FLEXOO secures funding to scale Physical AI platform globally
FLEXOO, a pioneer in physical AI sensor technology, has successfully closed its Series A funding round, raising a total investment of €11M. Lead investors are eCAPITAL and AUMOVIO. The funds will drive FLEXOO’s global business with customers that are internationally leading in the battery storage and automotive industries. Additionally, it will enable FLEXOO to continuously […]
Bayflex Solutions and MSWtech announce partnership expansion
At LOPEC 2026, Bayflex Solutions, a leader in flexible electronics testing and lab automation, announces a significant strengthening of its partnership with MSWtech to expand testing capabilities at the FAPS Institute in Nuremberg later this year. This expansion introduces integrated hostile environment testing tailored for automotive and avionics applications, alongside specialised liquid immersion testing for […]
Schreiner Group celebrates 75th anniversary
For 75 years, Schreiner Group has stood for innovation, quality, performance and enthusiasm. What began in 1951 in a small garage has grown into an internationally successful high-tech company. With the traditional dance of the Munich Schäffler (coopers) guild, Schreiner Group has now ceremoniously entered its 2026 anniversary year, deliberately highlighting the connection between historical […]
AUO named Top 100 Global Innovator five times in a row
AUO has been named in the Clarivate Top 100 Global Innovators 2026, marking its fifth consecutive recognition on the list. The honour reflects AUO’s sustained innovation across the company’s three core business pillars: Display, Mobility Solutions and Vertical Solutions, supported by continued R&D investment and a strengthened global patent portfolio that advances the company’s transformation. […]
Tageos and Wiliot partner to accelerate ambient IoT
Tageos, a global leader in RFID and wireless IoT inlays and tags, today announced a strategic partnership with ambient IoT pioneer Wiliot. The first outcome of this collaboration is the launch of a new passive Bluetooth Low Energy (BLE) inlay, the EOS-654 BLE G3. In response to the growing demand for real-time location and condition […]