Vom 8. bis 15. Oktober nahm EC-CONVERT, ein führender spanischer Hersteller und Entwickler von Maschinen für die Converting- und flexible Verpackungsindustrie, erfolgreich an der K 2025 in Düsseldorf teil – der weltweit bedeutendsten Fachmesse für Kunststoff und Verpackung. Im Mittelpunkt des Messeauftritts stand die Präsentation der neuesten Innovation des Unternehmens, der SLT2-140 – eine vollautomatische […]
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Just months after unveiling plans for a new automotive chiplet innovation hub in Baden-Württemberg (Germany), imec – a global leader in nanoelectronics and digital technologies – has inaugurated its office at the IPAI campus in Heilbronn. During the opening ceremony, Baden-Württemberg’s Minister-President Winfried Kretschmann and Minister of Economic Affairs, Labour and Tourism Dr Nicole Hoffmeister-Kraut […]
At month 18 of its three-year Horizon Europe project, the PEARL consortium has made decisive progress toward its target of 25% efficient, low-cost flexible perovskite solar cells with carbon electrodes. By combining cutting-edge materials research, pilot-scale roll-to-roll (R2R) manufacturing and comprehensive sustainability measures, partners across Europe have delivered a series of significant achievements. The researchers […]
As part of the Design-PV project, Fraunhofer FEP has made significant progress in developing aesthetically appealing solutions for building-integrated photovoltaics. Technologies such as roll-to-roll nanoimprint lithography enable solar modules to be seamlessly integrated into building facades without compromising the design. Initial tests show that the modules are visually indistinguishable from conventional facade elements yet offer […]
The Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is […]
With a festive event and a symposium on 24 June 2025, Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) celebrated 15 years of success in its field. Since its foundation in 2010, the Fraunhofer IZM’s Saxon site has become a globally respected engine of innovation in 3D system integration and wafer-level packaging – and a crucial […]