ICE Europe 2027 mit neuen Features und Erweiterungen

Die weltweite Converting-Industrie bereitet sich auf die nächste Ausgabe der ICE Europe vor. Die Veranstaltung will ihre Position als weltweit führende Fachmesse für die Verarbeitung von flexiblen, bahnförmigen und bogenförmigen Materialien weiter festigen. Die von RX organisierte ICE Europe findet vom 9. bis 11. März 2027 in München statt und wird erneut die gesamte Wertschöpfungskette […]

Feature

KOCH – Präzision in Rollenform, Automatisierung für Vliesstoffe

Wie zwei Projekte von KOCH Robotersysteme zeigen, dass Verpackung und Palettierung von Rollen kein Kraftakt mehr sein müssen. Vliesstoffe, Klebebänder oder technische Folien sind echte Alleskönner: Sie schützen, isolieren, verbinden und sind dadurch unverzichtbar in Medizin, Hygiene und Industrie. Ihr Wert zeigt sich erst am Ende der Produktionskette: Nur wenn die Materialien präzise auf Rollen […]

An overview of a complete line with KOCH automation

Alle News

11. Februar 2026 |

Heraeus Electronics – Driving PriElex forward as the go-to solution for printed electronics

PRO Flextronics sat down for an interview with Ryan Banfield, Global Product Manager, PriElex, at Heraeus Electronics. The company will showcase its polymer thick film portfolio at the upcoming LOPEC 2026 tradeshow. Mr Banfield, the flexible and printed electronics industry is entering 2026 with cautious optimism, as reflected in the latest OE-A Business Climate Survey. […]

10. Februar 2026 |

nsm – Transfer of perovskite processes from lab to pilot production

PRO Flextronics sat down for an interview with Michael Schläfli, CEO of nsm, which is based in Zofingen, Switzerland. His company offers an extensive portfolio of printing, coating and laminating equipment, with a special emphasis on pushing the boundaries of innovation in printed electronics. Mr Schläfli, your company nsm has been exhibiting at LOPEC for […]

A material paste for printed electronics

5. Februar 2026 |

Henkel Printed Electronics – Material innovation at the core

At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]

Hamamatsu's LD irradiation light source (SPOLD)

27. Januar 2026 |

Hamamatsu Photonics – Rising interest in laser technology for thermal surface activation

In recent years, laser surface treatment has gained popularity due to its efficiency and effectiveness. Today, laser applications in manufacturing are numerous. Building on these established techniques, new thermal laser processes are emerging that activate surfaces before the application of glues or adhesive films. This growing interest stems from laser process development, improved system integration […]

16. Oktober 2025 |

Heraeus Electronics – Medical sensors with polymer thick films

Artificial intelligence is accelerating breakthroughs in healthcare, enabling earlier disease detection, personalised treatment, and remote monitoring. With AI’s ability to process vast datasets, medical professionals can now deliver faster, more accurate care – even from the comfort of a patient’s home. At the heart of this transformation are medical sensors, such as continuous glucose monitors […]