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Bimec's line for Huhtamaki
20. Februar 2026

Huhtamaki installiert zwei neue Bimec-Anlagen in Südafrika

Huhtamaki Flexible Packaging hat seine langjährige Partnerschaft mit Bimec, einem italienischen Spezialisten für Schneid- und Wickelmaschinen, durch die Installation von zwei neuen TCA 64C+ Duplex-Turret-Schneid- und Wickelmaschinen in seinem Werk in Durban weiter ausgebaut. Die Maschinen sind seit September 2025 in Betrieb und laufen laut Angaben der Unternehmen bereits mit voller Kapazität. Nur vier Monate […]

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LOPEC 2026 – Wo Vision auf Serie trifft

Dünner, leichter, nachhaltiger: Die gedruckte Elektronik hat das Labor längst verlassen und definiert die Massenmärkte von Mobility bis Healthcare neu. Wer wissen will, welche Maschinen heute die Effizienz steigern und welche Trends morgen die Geschäftsmodelle dominieren, kommt Ende Februar an München nicht vorbei. Ein Blick auf das Highlight-Event der Branche. Die Elektronikfertigung befindet sich im […]

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LOPEC entrance
Alle News
11. Februar 2026 |

Heraeus Electronics – Driving PriElex forward as the go-to solution for printed electronics

PRO Flextronics sat down for an interview with Ryan Banfield, Global Product Manager, PriElex, at Heraeus Electronics. The company will showcase its polymer thick film portfolio at the upcoming LOPEC 2026 tradeshow. Mr Banfield, the flexible and printed electronics industry is entering 2026 with cautious optimism, as reflected in the latest OE-A Business Climate Survey. […]

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5. Februar 2026 |

Henkel Printed Electronics – Material innovation at the core

At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]

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16. Oktober 2025 |

Heraeus Electronics – Medical sensors with polymer thick films

Artificial intelligence is accelerating breakthroughs in healthcare, enabling earlier disease detection, personalised treatment, and remote monitoring. With AI’s ability to process vast datasets, medical professionals can now deliver faster, more accurate care – even from the comfort of a patient’s home. At the heart of this transformation are medical sensors, such as continuous glucose monitors […]

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2. Juni 2025 |

Heraeus Electronics advances the integration of printed electronics

In a conversation with PRO Flextronics, Mark Challingsworth, Global Head of Business Line Thick Film Materials, and Ryan Banfield, Product Manager PriElex at Heraeus Electronics, showcase the PriElex portfolio of printed electronics materials and its benefits for our industry. Mr Challingsworth, Mr Banfield, what are PriElex Functional Printed Electronics Materials, and how do they fit […]

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28. April 2025 |

Hamamatsu Photonics – Laser sintering as the future of PE

Laser sintering is a relatively new technology that uses lasers as efficient thermal energy sources for sintering metal particle-based inks. Semiconductor-based near-infrared (NIR) lasers wield several advantages over traditional methods, such as hot air ovens and flash lamp ovens, in sintering printed electronics. Semiconductor lasers are highly energy-efficient and have long lifetimes that exceed 20,000 […]

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