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16. April 2026

FPE spricht sich gegen Verzögerungen bei der PPWR aus

Flexible Packaging Europe (FPE) bekräftigt seinen entschiedenen Widerstand gegen jeden Versuch, die Verordnung (EU) 2025/40 über Verpackungen und Verpackungsabfälle (PPWR) erneut zur Diskussion zu stellen oder zu verzögern, nachdem kürzlich aus Teilen der Branche Forderungen laut wurden, deren Inkrafttreten zu verschieben und zentrale Bestimmungen zu überarbeiten. FPE räumt ein, dass nach wie vor einige Herausforderungen […]

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KOCH – Präzision in Rollenform, Automatisierung für Vliesstoffe

Wie zwei Projekte von KOCH Robotersysteme zeigen, dass Verpackung und Palettierung von Rollen kein Kraftakt mehr sein müssen. Vliesstoffe, Klebebänder oder technische Folien sind echte Alleskönner: Sie schützen, isolieren, verbinden und sind dadurch unverzichtbar in Medizin, Hygiene und Industrie. Ihr Wert zeigt sich erst am Ende der Produktionskette: Nur wenn die Materialien präzise auf Rollen […]

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An overview of a complete line with KOCH automation
Alle News
11. Februar 2026 |

Heraeus Electronics – Driving PriElex forward as the go-to solution for printed electronics

PRO Flextronics sat down for an interview with Ryan Banfield, Global Product Manager, PriElex, at Heraeus Electronics. The company will showcase its polymer thick film portfolio at the upcoming LOPEC 2026 tradeshow. Mr Banfield, the flexible and printed electronics industry is entering 2026 with cautious optimism, as reflected in the latest OE-A Business Climate Survey. […]

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10. Februar 2026 |

nsm – Transfer of perovskite processes from lab to pilot production

PRO Flextronics sat down for an interview with Michael Schläfli, CEO of nsm, which is based in Zofingen, Switzerland. His company offers an extensive portfolio of printing, coating and laminating equipment, with a special emphasis on pushing the boundaries of innovation in printed electronics. Mr Schläfli, your company nsm has been exhibiting at LOPEC for […]

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5. Februar 2026 |

Henkel Printed Electronics – Material innovation at the core

At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]

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16. Oktober 2025 |

Heraeus Electronics – Medical sensors with polymer thick films

Artificial intelligence is accelerating breakthroughs in healthcare, enabling earlier disease detection, personalised treatment, and remote monitoring. With AI’s ability to process vast datasets, medical professionals can now deliver faster, more accurate care – even from the comfort of a patient’s home. At the heart of this transformation are medical sensors, such as continuous glucose monitors […]

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2. Juni 2025 |

Heraeus Electronics advances the integration of printed electronics

In a conversation with PRO Flextronics, Mark Challingsworth, Global Head of Business Line Thick Film Materials, and Ryan Banfield, Product Manager PriElex at Heraeus Electronics, showcase the PriElex portfolio of printed electronics materials and its benefits for our industry. Mr Challingsworth, Mr Banfield, what are PriElex Functional Printed Electronics Materials, and how do they fit […]

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