SÜDPACK – Backwaren-Verpackungen im Einzelhandel

Die EU-Verpackungsverordnung PPWR stellt auch Hersteller industriell gefertigter Backwaren für den Lebensmitteleinzelhandel vor neue Anforderungen. Im Mittelpunkt steht die Recyclingfähigkeit: Etablierte Polyamid (PA)-Verbundstrukturen müssen überprüft und bei Bedarf durch recyclinggerechtere Konzepte ersetzt werden. Der Folienhersteller SÜDPACK hat sein Portfolio konsequent weiterentwickelt und bietet schon heute Lösungen für die Branche, die Produktschutz, Maschinenperformance und Wirtschaftlichkeit miteinander […]

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18. Mai 2026 |

Voltera – „Prototyping flexible electronics“

In flexible and printed electronics, the real challenge is not imagining new device concepts. It is validating them fast enough to matter. Whether the application is a flexible display, smart packaging, or thin-form energy storage, development teams need to assess how materials interact, how multilayer structures hold up, and how quickly a prototype can move […]

Fuell cell technologies are a growth market for Schobertechnologies

9. März 2026 |

Schobertechnologies GmbH – Rotary converting technologies for fuel cell manufacturing

Fuel cell technology is widely regarded as a key building block of future energy and mobility systems. From automotive applications to stationary power generation, fuel cells promise high efficiency and low emissions – provided that scalable, reliable manufacturing processes can be established. One of the critical challenges lies in the precise and gentle processing of […]

11. Februar 2026 |

Heraeus Electronics – Driving PriElex forward as the go-to solution for printed electronics

PRO Flextronics sat down for an interview with Ryan Banfield, Global Product Manager, PriElex, at Heraeus Electronics. The company will showcase its polymer thick film portfolio at the upcoming LOPEC 2026 tradeshow. Mr Banfield, the flexible and printed electronics industry is entering 2026 with cautious optimism, as reflected in the latest OE-A Business Climate Survey. […]

10. Februar 2026 |

nsm – Transfer of perovskite processes from lab to pilot production

PRO Flextronics sat down for an interview with Michael Schläfli, CEO of nsm, which is based in Zofingen, Switzerland. His company offers an extensive portfolio of printing, coating and laminating equipment, with a special emphasis on pushing the boundaries of innovation in printed electronics. Mr Schläfli, your company nsm has been exhibiting at LOPEC for […]

A material paste for printed electronics

5. Februar 2026 |

Henkel Printed Electronics – Material innovation at the core

At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]