Inno-Fiber 2026 – „Paperisation“ zwischen Anspruch und Realität

Mit der neuen Veranstaltungsreihe „Inno-Fiber“ hat die Innoform Coaching GmbH eine Plattform geschaffen, die den Transformationsprozess der Verpackungsindustrie aktiv begleitet. Unter dem Leitthema „Funktionelle Papiere für Verpackungsanwendungen“ diskutierten am 15. und 16. April 2026 in Osnabrück Experten aus Industrie und Forschung über Potenziale, Zielkonflikte und technologische Fortschritte faserbasierter Verpackungslösungen. Paperisation gewinnt an Dynamik – aber […]

Feature

Schobertechnologies – Höhere Leistung durch Rotationsstanzen

Schobertechnologies hat die Rotationsstanztechnik bereits vor Jahrzehnten in der Papier-, Film- und Folienverarbeitungsindustrie eingeführt. Das Verfahren bietet eine Reihe von Vorteilen, darunter höhere Produktionsleistung, Effizienz, Qualität und Präzision sowie hohe Prozesssicherheit und Produktionsstabilität. Es gilt zudem als umweltfreundliches Herstellungsverfahren. So funktioniert die Rotationsstanztechnik Beim Rotationsstanzen kommen zwei Zylinder zum Einsatz. Der obere Zylinder trägt den […]

Alle News

11. Februar 2026 |

Heraeus Electronics – Driving PriElex forward as the go-to solution for printed electronics

PRO Flextronics sat down for an interview with Ryan Banfield, Global Product Manager, PriElex, at Heraeus Electronics. The company will showcase its polymer thick film portfolio at the upcoming LOPEC 2026 tradeshow. Mr Banfield, the flexible and printed electronics industry is entering 2026 with cautious optimism, as reflected in the latest OE-A Business Climate Survey. […]

10. Februar 2026 |

nsm – Transfer of perovskite processes from lab to pilot production

PRO Flextronics sat down for an interview with Michael Schläfli, CEO of nsm, which is based in Zofingen, Switzerland. His company offers an extensive portfolio of printing, coating and laminating equipment, with a special emphasis on pushing the boundaries of innovation in printed electronics. Mr Schläfli, your company nsm has been exhibiting at LOPEC for […]

A material paste for printed electronics

5. Februar 2026 |

Henkel Printed Electronics – Material innovation at the core

At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]

16. Oktober 2025 |

Heraeus Electronics – Medical sensors with polymer thick films

Artificial intelligence is accelerating breakthroughs in healthcare, enabling earlier disease detection, personalised treatment, and remote monitoring. With AI’s ability to process vast datasets, medical professionals can now deliver faster, more accurate care – even from the comfort of a patient’s home. At the heart of this transformation are medical sensors, such as continuous glucose monitors […]

2. Juni 2025 |

Heraeus Electronics advances the integration of printed electronics

In a conversation with PRO Flextronics, Mark Challingsworth, Global Head of Business Line Thick Film Materials, and Ryan Banfield, Product Manager PriElex at Heraeus Electronics, showcase the PriElex portfolio of printed electronics materials and its benefits for our industry. Mr Challingsworth, Mr Banfield, what are PriElex Functional Printed Electronics Materials, and how do they fit […]