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Entrance area at interpack 2026
18. Mai 2026

interpack 2026 setzt globales Signal für die Branche

Die interpack 2026 hat die Energie einer ganzen Branche spürbar gemacht. Sie wurde wieder zum globalen Treffpunkt der Processing- und Packaging-Industrie und zeigte eindrucksvoll, wie konkret der Wandel in Technologie, Materialien und Prozessen bereits umgesetzt wird. Sichtbare Dynamik Die interpack 2026 hat ein klares Signal gesetzt: Die Verpackungsbranche ist enger vernetzt, innovationsstärker und dialogorientierter denn […]

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Feature

IPCO – „Gemeinsam können wir komplette Prozesslinien anbieten!“

Mit der Übernahme von New Era Converting Machinery Inc. durch IPCO AB ist ein neuer globaler Anbieter für Converting- und Prozessanlagen entstanden. Im Gespräch erläutern Jens Gegner, Global Segment Manager Composites bei IPCO, und Paul Lembo, Managing Director von New Era, wie sich die Zusammenarbeit entwickelt, welche Synergien sich ergeben – und wo die Reise […]

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Paul Lembo and Jens Gegner
Alle News
9. März 2026 |

Schobertechnologies GmbH – Rotary converting technologies for fuel cell manufacturing

Fuel cell technology is widely regarded as a key building block of future energy and mobility systems. From automotive applications to stationary power generation, fuel cells promise high efficiency and low emissions – provided that scalable, reliable manufacturing processes can be established. One of the critical challenges lies in the precise and gentle processing of […]

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11. Februar 2026 |

Heraeus Electronics – Driving PriElex forward as the go-to solution for printed electronics

PRO Flextronics sat down for an interview with Ryan Banfield, Global Product Manager, PriElex, at Heraeus Electronics. The company will showcase its polymer thick film portfolio at the upcoming LOPEC 2026 tradeshow. Mr Banfield, the flexible and printed electronics industry is entering 2026 with cautious optimism, as reflected in the latest OE-A Business Climate Survey. […]

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10. Februar 2026 |

nsm – Transfer of perovskite processes from lab to pilot production

PRO Flextronics sat down for an interview with Michael Schläfli, CEO of nsm, which is based in Zofingen, Switzerland. His company offers an extensive portfolio of printing, coating and laminating equipment, with a special emphasis on pushing the boundaries of innovation in printed electronics. Mr Schläfli, your company nsm has been exhibiting at LOPEC for […]

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5. Februar 2026 |

Henkel Printed Electronics – Material innovation at the core

At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]

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16. Oktober 2025 |

Heraeus Electronics – Medical sensors with polymer thick films

Artificial intelligence is accelerating breakthroughs in healthcare, enabling earlier disease detection, personalised treatment, and remote monitoring. With AI’s ability to process vast datasets, medical professionals can now deliver faster, more accurate care – even from the comfort of a patient’s home. At the heart of this transformation are medical sensors, such as continuous glucose monitors […]

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