embedded world 2026 – shaping the embedded future together

From 10 to 12 March 2026, the Exhibition Centre Nuremberg will once again become the international heart of the embedded industry: 1,262 exhibitors (2025: 1,188) from 43 countries will present innovations, expertise and trends for tomorrow’s connected world in seven exhibition halls covering 34,069 m² of net exhibition space – an increase of five percent […]

Avery Dennison and Pragmatic integrate chips on a mass-scale

Avery Dennison, a global leader in materials science and digital identification solutions, is set to further enhance its Near Field Communication (NFC) inlay portfolio with a flexible integrated circuit (FlexIC) product line, NFC Connect, from Pragmatic Semiconductor, a pioneer in flexible and sustainable semiconductor technology. First-to-market integration This first-to-market integration on a mass scale builds […]

Flex2Energy showcases green industry at LOPEC 2026

The two European flagship projects Flex2Energy and COPE-Nano Center of Excellence were presented at LOPEC 2026 (24–26 February 2026, Munich), underlining Europe’s – and particularly Greece’s – growing role in green industry and sustainable energy production. LOPEC is regarded as one of the leading international platforms for organic and printed electronics, bringing together stakeholders from […]

Extensive image gallery from LOPEC 2026

OE-A Competition – Winners announced at LOPEC

The winners of the OE-A Competition 2026 have been announced at the Award Show during LOPEC, highlighting the latest innovations in flexible, organic and printed electronics. Technological progress and market potential Each year, the competition recognises outstanding demonstrators and products that showcase the technological progress and market potential of the industry. The 2026 edition once […]