Inova Semiconductors, the driving force behind the ISELED Alliance, and TactoTek, the pioneer of In-Mould Structural Electronics (IMSE), are joining forces to accelerate the development of intelligent, space-efficient, conformal lighting solutions for the automotive sector.
The collaboration builds on a shared vision: to make electronics and lighting smarter, simpler, and seamlessly integrated into form. It combines Inova’s expertise in smart LEDs with integrated drivers and TactoTek’s patented IMSE technology, which enables electronics and lighting to be moulded directly into 3D surfaces — creating thin, lightweight, and reliable smart structures ready for series production.
ISELED Alliance
Both companies are members of the ISELED Alliance, founded by Inova in 2016 to create a complete ecosystem for digital in-vehicle lighting. With the new ISELED 2.0 specifications unveiled at the 6th ISELED Conference on 22 October 2025, the Alliance is taking another step toward even more intelligent and flexible lighting architectures. TactoTek is actively supporting this progress as the technology advances toward market introduction. By implementing ISELED 2.0 and ensuring IMSE compliance, LED partners can fully leverage the technological advancements enabled by this collaboration.
“Our mission with ISELED has always been to make intelligent lighting accessible, scalable, and efficient,” said Robert Isele, CEO of Inova Semiconductors. “Working with TactoTek extends this mission from electronics into structures.”
Driving commercial success
“At TactoTek, we are committed to empowering our licensees with practical, manufacturable solutions that drive commercial success and position them at the leading edge of the industry. Inova’s innovation and leadership within ISELED perfectly complement TactoTek’s IMSE capabilities,” added Jussi Harvela, CEO of TactoTek. “Together, we enable lighting that is smarter, lighter, and more sustainable — for automotive and beyond.”
The collaboration strengthens both the IMSE and ISELED ecosystems, demonstrating how technology leaders can co-create scalable solutions that unite intelligence, design freedom, and industrial reliability to advance innovation across industries.