BERHALTER Swiss Die-Cutting, a global leader in high-performance die-cutting technology, will participate at PACK EXPO International 2024, which will take place at McCormick Place, Chicago, from 3-6 November 2024. This premier industry event will bring together top professionals in packaging and processing for three days of live demonstrations, technological innovations, and networking opportunities.
At Booth 5680, BERHALTER Swiss Die-Cutting will showcase its most advanced die-cutting solutions, offering live demonstrations and expert consultations.
Key highlights
• Exclusive live demonstrations: Attendees will witness the power and precision of the BERHALTER Swiss Die-Cutter B6, capable of up to 500 strokes per minute. This cutting-edge machine is reported to set new benchmarks for speed, efficiency, and accuracy in die-cutting.
• CUTcontrol IIoT platform: Visitors can discover how the intelligent IIoT platform, CUTcontrol provides real-time data, enabling predictive maintenance and improving operational efficiency. Furthermore, they can learn how this platform can streamline production lines and minimise downtime.
• Meeting BERHALTER experts: Dalibor Schuman, Reto Frei, and Gregory Frei will be available at the booth to provide insights into how their solutions can optimise die-cutting processes, boost productivity, and reduce costs.
A perfect opportunity
For professionals in packaging, die-cutting, and manufacturing, PACK EXPO International 2024 is considered to be a perfect opportunity to discover the latest advancements in the industry. Attendees will benefit from:
• First access to new technologies: Get an exclusive look at the latest innovations in die-cutting, from high-speed cutting to digital platforms designed to maximise production efficiency.
• Personalised consultations: BERHALTER’s team of experts will be on-site to offer tailored advice and solutions to meet specific production challenges.
• Networking opportunities: Connect with industry leaders, exchange ideas, and gain valuable insights into the trends shaping the future of the packaging and processing industries.
“We are looking forward to showcasing our cutting-edge solutions at PACK EXPO International 2024,” said Dalibor Schuman, Managing Director of BERHALTER Swiss Die-Cutting. “This event provides a fantastic platform for us to demonstrate how our technologies can help businesses improve efficiency, sustainability, and competitiveness in today’s fast-paced market.”
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