ioTech, winner of the LOPEC Start-up Forum Award 2022 for Most Impactful Technology/Product, returns to LOPEC 2025 (ICM Foyer, Booth FO28.01 – 26-27 February) to showcase key developments on how its ground-breaking disruptive digital deposition technology is shaping the future of printed electronics.
ioTech’s io300 system is currently used by leading semiconductor manufacturers for prototyping, process development and batch production. ioTech’s cutting-edge Continuous Laser Assisted Deposition “CLAD” technology has been recognised by the European Innovation Council (EIC) as a game-changer, citing its ability to strengthen and scale up production and innovation across Europe’s semiconductor value chain.
io300’s most recent system advancements
- Unmatched design flexibility, achieving superior line perimeter definitions
- Consistent printing of both conductive and dielectric materials
- Direct import of CAD data for on-demand additive printing at high-resolution and high-speed
- Integrated post-processing options such as UV or heat curing, laser sintering and ablation
- Sequential multi-layer and multi-material process, facilitating the production of electro-functional structures and taking digital manufacturing to the next level
In addition, on 26 February at 2:20 PM, ioTech’s Stéphane Etienne, will deliver a presentation at the LOPEC Conference, titled “Sustainable: An Innovative Contactless Technology for High Resolution, High Speed, Conductive and Dielectric Materials Deposition.” This session will highlight ioTech’s pioneering approach to high-speed, high-precision material deposition while emphasising sustainability in electronics manufacturing.
Transforming advanced electronics manufacturing
Hervé Javice, CEO of ioTech, stated: “We are thrilled to return to LOPEC and showcase how our CLAD technology is transforming advanced electronics manufacturing. It offers unmatched flexibility, precision, and scalability. The opportunities enabled by our technology are limitless, and we look forward to engaging with industry leaders ready to embrace the future of micro-electronics and digital manufacturing.”