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12. November 2024 |

Canatu ranked as one of fastest-growing tech companies in Finland

Canatu, a fast-growing deep-tech company creating advanced carbon nanotubes (Canatu CNTs), related products, and manufacturing equipment for the semiconductor, automotive, and medical diagnostics industries, has been recognised by the Deloitte Technology Fast 50 programme as one of Finland’s fastest-growing technology companies. The Deloitte Technology Fast 50 Finland ranks the fastest-growing technology companies in Finland, both […]

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10. November 2024 |

Henkel, Covestro and Quad Industries partner in medical wearables

Henkel, Covestro and Quad Industries have announced a partnership in the field of printed electronics. By joining forces and combining their different areas of expertise the companies aim to accelerate customer developments for advanced medical wearables and to further drive the adoption of innovative printed electronics solutions especially for stretchable materials in healthcare applications. Henkel […]

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31. October 2024 |

Industrias Alegre and TactoTek partner in in-mould electronics parts

Industrias Alegre from Valencia, Spain, has signed a collaboration agreement with TactoTek, a Finnish pioneer in smart surfaces and world leader in In-Mould Structural Electronics (IMSE) technology. The collaboration will involve the development of innovative human-machine interface (HMI) solutions that can be integrated into applications for different markets, especially automotive. New designs for lighter and […]

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29. October 2024 |

Rocket Award winner FLEXOO goes electronica 2024

FLEXOO will be exhibiting at electronica 2024, the world’s leading trade fair for electronics, held from 12-15 November at Messe München. This event gathers over 3,000 exhibitors and 70,000 visitors to explore groundbreaking technologies that shape a sustainable and connected world, covering fields from AI-powered automation to electromobility. At electronica, FLEXOO will showcase its cutting-edge […]

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26. October 2024 |

Fraunhofer IPMS and BASF – Improved microchip interconnections

More power, more energy-efficiency, more complexity – manufacturers of modern microchips are constantly facing new challenges, also regarding the electrical connections required. Fraunhofer IPMS and BASF have been working together on this problem for ten years. The teams have pooled their infrastructure and expertise and thus have made it possible to evaluate chemicals, processes and […]

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