The next OE-A Meeting will take place on 24-25 September 2024 at tesa, in Hamburg/Norderstedt. OE-A member tesa will open its technical centre and R&D labs to the OE-A community. At the same time, the OE-A (Organic Electronics Association) will celebrate its 20th anniversary.
Special topics
- Next Gen Communication with Flexible and Printed Electronics
- Empowering Connectivity with NFC/RFID and Applications for 5G/6G and Mobility
Visitors can gain insights into tesa’s facilities by a guided tour of the technical centre and R&D labs of the company. Furthermore, they will learn about hearing, enterprise, gaming & consumer in an end-user presentation by Jabra.
An interactive BarCamp Session enables attendees to discuss “hot topics” amongst themselves: All attendees are encouraged to propose a session topic.
The exchange of ideas and knowledge will also be central during the scheduled meetings of the OE-A Working Groups Hybrid Systems, Encapsulation, Sustainability and Fuel Cells, as well as a best practice in marketing presentation about accelerating the future paint shop with fully automated hole covering.
Co-located company visits
23 September 2024, 15:30 – 17:30 h: Company tour ELANTAS
25 September 2024, 15:30 – 18:00 h: Company tour KROENERT
OE-A at electronica 2024
From 12-15 November 2024, electronica, the world’s leading trade fair and conference for electronics takes place in Munich. OE-A and LOPEC will represent the flexible, organic and printed electronics industry with a two-day Printed Electronics Forum on 13 and 14 November.
This year, OE-A and LOPEC will organise a Printed Electronics Forum with two sessions. OE-A’s seminars “Applications & Technologies” as well as “Automotive Applications” at the Printed Electronics Forum will focus on recent and future developments of materials, processes and applications of the Printed Electronics industry with a special focus on the automotive market. Renowned experts will share insights on smart surfaces, HMI, printed batteries and much more.
Experts from the following companies will be presenting: 2D ApS- DK, BayflexSolutions- US, Centi- PT, Copprint- IL, Flexoo- DE, Hahn-Schickard- DE, Hamamatsu Photonics- DE, Henkel- BE, Hummink- FR, Interlink Electronics Inc.- US, Lohmann- DE, PolyIC- DE, Rise- SE, Saralon- DE, Tactotek- FI, VTT- FI, Witte Technology- DE, Ynvisble- FI