Fraunhofer FEP’s Microdisplays and Sensors business unit to be integrated into Fraunhofer IPMS
The Microdisplays and Sensors business unit at the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be integrated into the Fraunhofer Institute for Photonic Microsystems IPMS with retroactive effect from 1 January 2024. Both institutes are closely connected, particularly within this business unit, and share infrastructure at the Dresden site. By […]
Tampere University joins efforts to support the transition to sustainability across the electronics industry
As the raw materials for consumer and industrial electronics will run out in the future, the electronics industry needs to find sustainable alternatives and adopt circular business models. The Sustronics project funded by the European Union is looking to pioneer the implementation of the European Green Deal by integrating sustainability principles into the design, supply […]
Texas A&M University: 3D printed electronic skin provides promise for human-machine interaction
With more than 1000 nerve endings, human skin is the brain’s largest sensory connection to the outside world, providing a wealth of feedback through touch, temperature and pressure. While these complex features make skin a vital organ, they also make it a challenge to replicate. By utilising nano-engineered hydrogels that exhibit tunable electronic and thermal […]
Fraunhofer FEP demonstrates high-speed light modulation for OLED, micro-LED and LCOS arrays
High-resolution light modulators determine the graphical experience in virtual reality (VR) glasses or the performance in optical communication. A new backplane architecture for light modulation has been developed at Fraunhofer FEP, thanks to which extremely high refresh rates now lead to improved image quality and optical modulation. The new backplane architecture and the high-resolution displays […]