On 10 and 11 June 2026, Silicon Valley will once again become a focal point for innovation in advanced electronics manufacturing. With its upcoming conference and exhibition, The Future of Electronics RESHAPED USA, TechBlick is set to deliver a comprehensive gathering dedicated to additive, hybrid, sustainable, and wearable electronics. Taking place at the iconic Computer History Museum in Mountain View, California, the event is expected to attract more than 550 industry professionals from across the global electronics ecosystem.
Building on the strong reputation of its European counterpart (TechBlick Berlin, 21-22 October 2026), the RESHAPED USA event reflects the accelerating convergence of materials science, advanced manufacturing, and application-driven innovation. It provides a platform where researchers, OEMs, startups, and material suppliers meet to explore how electronics are evolving beyond rigid boards and conventional production methods toward flexible, embedded, and sustainable solutions.
A convergence of technologies reshaping electronics
At its core, the event focuses on a broad spectrum of emerging technologies, including additive manufacturing, printed and hybrid electronics, flexible and textile-based systems, as well as soft and 3D electronics. These technologies are increasingly enabling entirely new product categories, ranging from wearable medical devices and smart packaging to soft robotics and structurally integrated electronics.
A key theme throughout the conference is the transition from lab-scale innovation to industrial-scale deployment. Topics such as reliability, scalability, and integration into existing manufacturing ecosystems are therefore prominently featured. In addition, sustainability plays a central role, with discussions addressing material choices, circular design strategies, and energy-efficient production processes.
The co-location with Wearables RESHAPED further strengthens the application focus, particularly in healthcare, sports, and human-machine interfaces. Wearable sensors, smart textiles, and bio-integrated electronics are expected to be among the highlights, showcasing how electronics are increasingly merging with the human body and everyday environments.
World-class agenda with cross-industry perspectives
The conference agenda, curated by TechBlick in collaboration with NextFlex, features more than 75 confirmed speakers from leading industrial companies, research institutions, and government organisations. Participants can expect insights from organisations such as Medtronic, NASA, Roche, Lockheed Martin, GE Healthcare, the Air Force Research Laboratory, Raytheon, GE Aerospace, Stanford University, and Rice University.
This diverse speaker lineup reflects the cross-industry relevance of next-generation electronics. Aerospace, healthcare, defence, and consumer electronics sectors are all contributing to – and benefiting from – the rapid evolution of manufacturing technologies.
A special highlight is the inclusion of the NextFlex Innovation Day on 9 June, which underscores the growing importance of flexible hybrid electronics (FHE) in the United States. As a public-private partnership, NextFlex plays a pivotal role in advancing manufacturing innovation and strengthening domestic supply chains.
Deep-dive learning and hands-on experiences
Beyond the main conference programme, attendees have the opportunity to deepen their expertise through a series of eight masterclasses and two company tours, also taking place on 9 June. These sessions are designed to provide practical insights into key topics such as printed electronics manufacturing, material selection, device integration, and testing methodologies.
The masterclasses cater to both newcomers and experienced professionals, offering a structured way to gain hands-on knowledge and better understand the complexities of emerging production technologies. Meanwhile, the company tours provide a rare behind-the-scenes look at cutting-edge facilities, bridging the gap between theoretical knowledge and real-world implementation.
Exhibition nearly sold out
Complementing the conference is a vibrant exhibition featuring around 75 global tabletop exhibitors. These companies will showcase the latest materials, equipment, prototyping solutions, and manufacturing services that are driving the next wave of electronics innovation.
With the exhibition floor already almost sold out, the strong demand underlines the growing commercial interest in additive and hybrid electronics. For many exhibitors, the event offers a unique opportunity to connect directly with decision-makers, demonstrate new capabilities, and establish partnerships across the value chain.
Focus on wearable sensors, actuators and soft robotics
One of the standout thematic tracks of the 2026 edition is dedicated to wearable sensors, actuators, and soft robotics. The programme highlights how stretchable electronics, functional inks, and novel substrates are enabling devices that can conform to complex surfaces and operate reliably under mechanical stress.
Applications range from continuous health monitoring and rehabilitation technologies to industrial safety systems and next-generation human-machine interfaces. In parallel, soft robotics is opening new possibilities for automation in delicate environments, where traditional rigid systems are not suitable.
These developments illustrate a broader shift toward electronics that are not only functional but also adaptive, lightweight, and seamlessly integrated into their surroundings.
A global hub for collaboration
With its combination of conference, exhibition, and networking opportunities, The Future of Electronics RESHAPED USA positions itself as a global hub for collaboration in next-generation electronics. The event brings together stakeholders from across the value chain – from material innovators and equipment manufacturers to system integrators and end-users.