OE-A and VDMA will be exhibiting at a dedicated booth during productronica from 18-21 November 2025. OE-A will highlight Printed Electronics on 19 and 20 November through two dedicated sessions. Again located in Hall B2: the Printed Electronics Pavilion powered by LOPEC.
OE-A Seminars on Printed Electronics at the Innovation Forum
Taking place during the 19-20 November 2025 event in Munich, these seminars will cover trending topics relevant to the industry. As a partner of productronica, OE-A will host free sessions showcasing the latest developments, future technologies, industry trends, and growth markets in flexible, organic, and printed electronics. OE-A members will present their innovations and insights.
Visit the OE-A Booth in Hall B2
Meet the team at the joint OE-A & VDMA productronica exhibition booth in hall B2.453. Discover more about OE-A, its international network, services, and the OE-A Roadmap at the booth located in hall B2, adjacent to the Innovation Forum.
Printed Electronics Pavilion Powered by LOPEC
The Printed Electronics Pavilion powered by LOPEC is located on the east side of Hall B2. The Future Production Cluster is also located in this hall. This is productronica’s special area for IT to production, Industry 4.0, manufacturing technologies for batteries and electrical energy storage systems, organic and printed electronics, 3D printing and additive manufacturing.
Flexible and Printed Electronics: Applications and Technologies
Date: Wednesday, 19 November 2025
Time: 14:15 – 16:10 h
Venue: Innovation Forum, Hall B2.441
Moderation: Dr Klaus Hecker, Managing Director, OE-A
» 14:15 h Introduction to Printed Electronics
Dr. Klaus Hecker, Managing Director, OE-A (DE)
» 14:25 h Printed Electronics – current applications and future trends
Dr Alain Schumacher, CTO, IEE (LU)
» 14:45 h Manufacturing and applications of large-area LED foils
Dr Ashok Sridhar, CEO & Co-founder, TracXon (NL)
» 15:05 h Hybrid electronics compared to conventional PCBs: their advantages
and challenges
Jonas Deitschun, Head of Department Advanced Printing Technologies,
Fraunhofer IFAM (DE)
» 15:25 h Pilot services for supporting and accelerating flexible electronics R&D
Prof Jukka Hast, Research Manager, VTT (FI)
» 15:45 h Debonding on demand tapes for rework, repair, and recycling in
electronics
Tom Schümchen, Innovation Manager, Lohmann (DE)
» 16:05 h Summary & Adjourn
Dr Klaus Hecker, Managing Director, OE-A (DE)
» 16:10 h End
Flexible and Printed Electronics: Materials, processes and reliability
Date: Thursday, November 20, 2025
Time: 14:15 – 16:30 h
Venue: Innovation Forum, Hall B2.441
Moderation: Raswanth Sendhil Sasikala, Project Manager, OE-A
» 14:15 h Introduction to Printed Electronics
Raswanth Sendhil Sasikala, Project Manager, OE-A (DE)
» 14:25 h Functionalizing 3D parts with precision: pad printing as a scalable
alternative manufacturing technology
Anna Ryzhova, Business Development Manager EIMEA, Henkel (DE)
» 14:45 h Rebuilding the EU PCB industry by moving from chemical etching to
additive printing of copper inks
Dr Ofer Shochet, CEO & Co-founder, Copprint (IL)
» 15:05 h Recent development on soluble materials for printed OLEDs
Dr Junyou Pan, CTO, Zhejiang Brilliant Optoelectronic (CN)
» 15:25 h tbd
N.N., XTPL (PL)
» 15:45 h Developments in AI to enhance FHE reliability and manufacturing
at scale
Wolfgang Mildner, Managing Director Europe, Bayflex (US)
» 16:05 h tbd
Herve Javice, Co-Founder & CEO, I-O-Tech (IL)
» 16:25 h Summary & Adjourn
Raswanth Sendhil Sasikala, Project Manager, OE-A (DE)
» 16:30 h End