The embedded world Exhibition&Conference once again offers the international embedded community an outstanding programme of forums. The highlights are five expert panels in which leading figures from the semiconductor, automotive, security and AI industries discuss the most important technological, regulatory and strategic developments.
C Level Insights: Strategic Trends in the Embedded Industry
Tuesday, 10 March, 1:30–2:30 p.m. | Hall 3, Booth 3-611
In the panel discussion “c-level@embedded world”, top managers from leading technology companies will discuss the current challenges and future prospects of the embedded market. This year’s participants include executives from AMD, Green Hills Software, Lattice Semiconductor and onsemi. The discussion will be moderated by Prof. Dr.-Ing. Axel Sikora, Chairman of the embedded world Conference.
RISC V in the automotive sector: breakthrough or challenge?
Wednesday, 11 March, 11:30 a.m.–12:30 p.m. | Hall 5, Booth 5-210
The panel discussion “Is RISC V Ready for Automotive? Is Automotive Ready for RISC V?” will focus on how well the open processor architecture RISC V is suited for use in vehicles – and whether the automotive industry is ready to use this technology more widely. Experts from Quintauris, Infineon, SiFive and Siemens EDA will discuss the advantages of RISC V, the technical requirements that are particularly important in cars, and the challenges that exist in terms of security, the software ecosystem and new chip architectures. The panel will be moderated by Andrea Gallo, CEO of RISC V International.
Cyber Resilience Act: Regulation meets practice
Wednesday, 11 March, 1:30–2:30 p.m. | Hall 3, Booth 3-611
The panel discussion “Navigating the EU Cyber Resilience Act: From Policy to Practice” will examine the impact of the CRA on manufacturers of products with digital elements. Experts from the EU Commission, the BSI and CENELEC will discuss requirements such as software bills of materials (SBOM), vulnerability handling, CE conformity and the economic consequences for complex supply chains. The panel will highlight the practical hurdles companies currently face in implementing the CRA – from the financial impact of new development and security processes to the complexity of global supply chains and the challenge of reconciling rapid innovation cycles with strict regulatory requirements. Moderated by Preeti Ohri Khemani, Senior Director CSS SRI, Infineon Technologies.
Cybersecurity for Software Defined Vehicles
Thursday, 12 March, 11:30 a.m.–12:30 p.m. | Hall 5, Booth 5-210
The panel discussion “Emerging Cybersecurity Strategies for Software-Defined Vehicles” will examine how modern software-defined vehicles, with their multitude of connected systems, autonomous functions and cloud-based services, pose new challenges for cybersecurity. Experts from NXP, ARM, Judge Group, Aumovio and Siemens will discuss current security approaches – from hardware root of trust and secure boot mechanisms to the protection of over-the-air updates and AI-supported methods for detecting attacks. The host is Nicholas Glewicz, Vice President of Judge Group.
Embedded Vision & Physical AI: New Hardware for New Possibilities
Thursday, 12 March, 1:30–2:30 p.m. | Hall 3, Booth 3-611
The panel discussion “Embedded Vision on the Rise” will show how modern GPU and NPU architectures and “Physical AI” are accelerating the development of intelligent, autonomous systems. Experts from FRAMOS, Allied Vision, MVTec and Intel will discuss performance requirements, edge AI optimisation, sensor technology, cost efficiency and future fields of application, from robotics to smart devices and industrial automation. The moderator is Anne Wendel, VDMA Robotics + Automation.