Schobertechnologies will present its solutions for In-Mould Label (IML) processing at LOUPE Americas 2026, taking place from 15-17 September in Chicago, USA.
Single Spider Plus system
At booth 6623, the company will demonstrate its RSM IML MX 410 in live operation. The machine is equipped with the Single Spider Plus system for precise rotary die-cutting and automated stacking of in-mould labels. In addition, the system can be configured with various options to meet individual production requirements.
Alongside the RSM IML MX 410, Schobertechnologies will provide information on further solutions from its product portfolio. These include rotary die-cutting and perforating modules designed for processing multiple blisters per sheet or individual packages made from various materials, including PVC and PET. The company will also showcase high-capacity rotary die-cutting modules featuring a mechanically pre-set pressure load system and precision magnetic cylinders for web widths of up to 1,000 mm and cylinder repeats of up to 40 inches.
High-performance punching modules
The exhibition portfolio will also feature high-performance punching modules for dense punching patterns with exchangeable punches and dies, enabling the processing of paper, films and foils as thin as 0.015 mm. In addition, Schobertechnologies will present its built-in and drop-in punching modules, equipped with a new generation of line hole punching tools and an integrated punch waste removal system designed for easy integration into a wide range of narrow web printing presses.