As AI applications continue to proliferate, demand for high-performance computing and high-speed data transmission is accelerating, making AI infrastructure capacity a critical enabler of industry growth. Targeting key technologies at the forefront of AI infrastructure, AUO showcased its latest advancements in optical communications and advanced semiconductor packaging at SEMICON Taiwan 2026, from 2-4 September 2026.
Optical communication solution
At the booth of AUO Group company Daxin Materials (L1210), AUO presented an optical communication solution featuring a system-level Micro LED co-packaged optics (CPO) module developed in collaboration with ecosystem partners. In parallel, AUO and Corning presented advanced semiconductor packaging technologies based on glass core substrates (GCS) at Corning’s booth (L1030). Together, these exhibits demonstrated the Group’s technological capabilities and strategic commitment to advancing both optical communications and advanced semiconductor packaging.
Building on more than three decades of expertise in glass substrate processing, AUO is developing next-generation Micro LED optical communication solutions by leveraging its strengths in optical coupling, heterogeneous integration, and precision manufacturing, together with its industry-leading Micro LED technology platform.
Targeting high-speed, short-reach interconnects of up to 10 meters in AI data centers, AUO provides key integration capabilities including mass transfer, redistribution layer (RDL) packaging, optical coupling, and system architecture design. The solution integrates Micro LED transmitters (Tx) from group company Ennostar and Micro photodetector receivers (Rx) from Tyntek, with Daxin’s photosensitive dielectric materials expected to be incorporated into the RDL packaging structure. Together with optical fiber solutions from ecosystem partner Corning, AUO is developing a system-level Micro LED CPO optical module designed for high-speed interconnect applications such as co-packaged optics (CPO) and active optical cables (AOC).
Compared with conventional optical communication solutions that transmit data through only a limited number of high-speed optical channels, the system-level Micro LED CPO optical module employs a wide-and-slow parallel architecture, in which a large array of Micro LED channels collectively carry data traffic. By reducing reliance on power-intensive signal compensation mechanisms, the architecture helps sustain transmission performance while lowering thermal management requirements. With thermal stability of up to 125°C, an operational lifetime of more than 30,000 hours, and ultra-low power consumption, the Micro LED light sources used in the transmitters (Tx) help reduce power consumption and thermal load during data transmission, making the module well suited for high-density, energy-efficient computing environments such as AI data centers.
AUO is also leveraging its expertise in large-format glass processing, precision metallization, and redistribution layer (RDL) technology, while progressively advancing through glass via (TGV) formation, via metallization, and reliability validation. In collaboration with key partners, AUO continues to advance material and processes to accelerate the development of advanced semiconductor packaging technologies.
Glass core substrates
At SEMICON Taiwan 2026, AUO showcased glass core substrates (GCS) technology at the Corning booth, combining Corning’s semiconductor-grade glass with AUO’s RDL process technology, which addresses advanced packaging requirements for larger AI server processor dies, high-density interconnects, and low-loss signal transmission.
Featuring a low coefficient of thermal expansion, high dimensional stability, and low signal loss, AUO’s glass core substrates help mitigate warpage in large-format packages while supporting higher-density circuit designs and high-speed data transmission. Compared with conventional substrates, the technology is better suited to next-generation advanced packaging for artificial intelligence (AI), high-performance computing (HPC), high-bandwidth memory (HBM), and co-packaged optics (CPO), helping enhance overall system performance and energy efficiency.
“AI is driving demand for computing performance while redefining the value of optical communications and advanced semiconductor packaging in next-generation computing architectures. Future competitiveness will depend not only on advances in individual components, but also on system-level integration across materials, components, and modules,” said Wei-Lun Liao, Chief Technology Officer of AUO.
“ Leveraging its expertise in optoelectronic integration, heterogeneous integration, and collaboration across the ecosystem value chain, AUO is accelerating the commercialisation of Micro LED CPO optical communication solutions and advanced semiconductor packaging technologies to deliver more efficient and reliable solutions for next-generation high-speed interconnect architectures.”
Micro LED CPO optical communication applications and advanced semiconductor packaging technologies are important enablers of AUO’s AI Four Arrows strategy. As AI adoption continues to accelerate, the Group will further advance these technologies, expand its product portfolio, and broaden their applications across data centres, smart cockpits, and other domains. Leveraging its strengths in optoelectronic integration and system-level module development, AUO will continue to deliver innovative and diversified solutions for next-generation AI infrastructure.