E Ink, a pioneer and leading global developer of ePaper technology, announced a significant early investment in NewCopper, a privately held U.S. technology startup developing conductive copper ink. The investment will establish opportunities for technical collaboration in display materials and printed electronics while supporting the development of a more localised and resilient supply chain.
As flexible electronics expand into applications such as displays, sensors, solar technology, RFID and connected devices, manufacturers are seeking alternatives to high-cost silver ink, which is widely used to create conductive pathways in printed components. Copper offers strong conductivity at a lower material cost, but its susceptibility to oxidation has historically limited its broader adoption. NewCopper developed a proprietary low-temperature, reactive and self-passivating copper ink formulation designed to overcome this challenge.
Significant increase in global copper demand
The rapid growth of AI data centres, electric vehicles, and broader electrification is expected to drive a significant increase in global copper demand. Meeting that demand through additional mining alone is neither ideal nor aligned with a long-term sustainability philosophy centred on resource efficiency and circularity. Technologies that enable copper to be effectively recovered, reused, and returned to the manufacturing cycle can reduce reliance on newly mined materials while supporting the continued expansion of these critical industries.
NewCopper’s technology originated from breakthrough joint research from Professor Shenqiang Ren’s team at the University of Maryland and Professor Liangbing Hu at Yale University. NewCopper holds an exclusive license from the University of Maryland for the proprietary copper ink formulation.
E Ink will make the investment through a post-money Simple Agreement for Future Equity (SAFE) and leverage its display manufacturing expertise to support NewCopper’s production scale-up and commercialisation. Because NewCopper’s formulation is compatible with E Ink’s roll-to-roll coating capabilities, the investment also creates an opportunity for E Ink’s R&D team to evaluate copper ink as a potential conductive material for future displays and electrode applications. More broadly, the collaboration strengthens the localised supply chain for advanced electronic materials and supports the future production of ePaper components.
E Ink management involvement with Taiflex
This investment is particularly relevant given the recent E Ink management involvement with Taiflex, a market leader in FCCL that is expanding into high-frequency CCL materials for PCBs used in AI and data-centre applications. As participation in the advanced PCB materials ecosystem grows, NewCopper represents a strong strategic fit—connecting investments in next-generation technologies with a broader commitment to lower-impact manufacturing, resource efficiency, and a more circular supply chain.
“E Ink itself spun out of academia into a global technology company, so we recognise both the promise of NewCopper’s innovation and the challenges of moving breakthrough technology from the lab to the market,” said Johnson Lee, chairman and CEO of E Ink. “As an established leader in materials and display manufacturing, it’s our responsibility to help promising companies scale. By supporting NewCopper with resources, expertise and commercialisation experience, we can also help guide the display industry to new heights.”
As part of the strategic relationship, Johnson Lee has joined NewCopper’s Board of Directors.