Miraclon has reinforced its longstanding partnership with Windmöller & Hölscher (W&H) through the installation of a new FLEXCEL NX Ultra 42 Solution at the W&H Technology Center in Lengerich, Germany. The new system replaces the previously installed FLEXCEL NX Ultra 35 Solution, giving W&H a larger format, water-processed platemaking solution to demonstrate a broader range […]
Read more »Thinner, lighter, more sustainable: Printed electronics has long since left the laboratory and is redefining mass markets from mobility to healthcare. Anyone who wants to know which machines are increasing efficiency today and which trends will dominate business models tomorrow should make sure to visit Munich at the end of February. A look at the […]
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Sun Chemical is set to present its latest electronic materials solutions at LOPEC 2026, held in Munich (24-26 February), on booth B0.201, reflecting the company’s continuous commitment to innovation within electronic materials. Sun Chemical will showcase its advanced functional ink range, including conductive and dielectric ink solutions, for use in industries such as automotive, home […]
VTT and PrintoCent industry partners are joining LOPEC, the world’s leading exhibition and conference for flexible, organic and printed electronics. Every year, the leading players from application to research meet in Munich, Germany. The event will be held from 24–26 February. Exhibiting at booth B0.606 VTT is a world-class R&D partner in printed, flexible and […]
The embedded world Exhibition&Conference once again offers the international embedded community an outstanding programme of forums. The highlights are five expert panels in which leading figures from the semiconductor, automotive, security and AI industries discuss the most important technological, regulatory and strategic developments. C Level Insights: Strategic Trends in the Embedded Industry Tuesday, 10 March, […]
From indoor solar cells and green electronics to sensor systems for agriculture: At LOPEC in Munich, the world’s leading trade fair with accompanying conference for flexible, organic and printed electronics, visitors will gain valuable insight into the latest technological developments from 24-26 February 2026. More than 160 international exhibitors will be presenting new materials, manufacturing […]
TechBlick’s international conference and exhibition, The Future of Electronics RESHAPED USA, will take place on 10–11 June 2026 at the Computer History Museum in Mountain View, California. The event will bring together stakeholders from across the additive, printed, hybrid and 3D electronics value chain. More than 600 participants and 80 exhibitors expected Positioned in the […]
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