Perovskite-based and organic photovoltaic (OPV) cells represent a promising pathway to renewable energy generation due to their potential for lightweight, flexible, and potentially cost-effective solar power generation. Panacol complements new OPV technologies with Elecolit 3648, a newly developed conductive adhesive. Elecolit 3648 addresses one of the critical challenges in the commercialisation and long-term reliability of organic solar cells: creating long-lasting, flexible electrical connections that create and maintain reliable electrical circuits.
Electronic components are typically connected by soldering. However, solder materials are rigid and inflexible, and soldering temperatures are often too high for potentially heat-sensitive photoactive materials. Conventional conductive adhesives cure at lower temperatures but can still be brittle and inflexible.
Good adherence to plastics
This is why Elecolit 3648 is a significant introduction. It is a very flexible, conductive adhesive. As it adheres well to plastics, including PI, PC, PVC, ABS, and FR4, Elecolit 3648 is the perfect choice for efficiently attaching wire leads and components to create flexible connections.
Elecolit 3648 can be cured at relatively low temperatures of 80°C within a few minutes. At higher temperatures, it can be hardened within seconds as a “snap cure” adhesive. As a one-component system, the new adhesive simplifies manufacturing processes by eliminating the need for mixing and therefore ensures a consistent application. It is easy to process and can be dispensed by conventional dispensing equipment, by jetting or screen printing.
Elecolit 3648 can efficiently secure flexible resistors and create flexible electrical connections in solar cells to lead the generated electricity from the conductive tracks to the end device. This adhesive is also effective in touch sensors or wearable devices where flexibility is a desired property.
Replacing solder joints
These features make Elecolit 3648 the perfect solution to replace solder joints in applications subjected to vibration, oscillation or rapid temperature changes. This can include all configurations of flexible electronics, and specifically OPV. As the adhesive maintains its integrity after repeated bending and stretching, the new adhesive can help to facilitate the development of new devices that withstand challenging operating conditions without losing performance.
From 23rd to 24th October 2024, Panacol will exhibit at TechBlick in Berlin, Estrel Congress Center, Booth C03.