Graphene Flagship celebrates successes of first-of-its-kind 2D materials project
The Graphene Flagship is hosting a symposium from 11-12 June at the Town Hall Europe, Brussels, to celebrate the successes of its €20 million 2D Experimental Pilot Line (2D-EPL) project. Representing the first graphene foundry to integrate graphene and other 2D materials into semiconductor devices, the symposium will demonstrate the 2D-EPL’s progress in creating an […]
Rapidus and Fraunhofer IZM join forces for high-end performance packaging
Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, and Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, join forces for advanced packaging solutions for 2nm node high-performance computing modules. Rapidus is building a fab on the island of Hokkaido to manufacture 2nm node microchips and the related high-end performance package. METI, Japan‘s […]
Crucial role for imec in EU Chips Act
At its technology forum ITF World 2024, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, announced it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth, and strengthen Europe’s semiconductor ecosystem. With its R&D pilot line, imec aims […]
Fraunhofer IPMS develops transparent emissive microdisplays for augmented reality systems
As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for Photonic Microsystems IPMS have developed a semi-transparent microdisplay. This microdisplay is significantly lighter than conventional combiner-based optical see-through near-to-eye systems and offers high resolution. The microdisplay will be presented at the SID Display […]
“ALUSolder” project – development of resource-saving electronics based on an aluminium printed circuit board
As part of the innovation network “Hidronik: Hybrid systems with printed electronics”, which is coordinated by ENERGIEregion Nürnberg e.V., Plasma Innovations GmbH is working on the “ALUSolder” project together with the companies Powerlyze GmbH and PCB-Systems GmbH as well as TH Nuremberg (Nuremberg’s Institute of Technology). The aim is to develop resource-saving electronics based on […]