Company logos TactoTek and TNO

© TactoTek/TNO

TactoTek and TNO at Holst Centre partner to advance IMSE and circularity

TactoTek and TNO at Holst Centre have entered a strategic relationship to advance the state-of-the-art of in-mould structural electronics (IMSE), including working together to build an ecosystem for sustainability and recycling. The companies’ joint research will include methods for recycling IMSE solutions that integrate circuitry and electronic components within 3D plastics. The companies share the bold ambition of making IMSE parts the first truly circular electronics devices.

TNO at Holst Centre is a global innovation and research leader whose specialties include printed and flexible electronics as well as climate impacts. According to Jeroen van den Brand, Department Manager of Printed Electronics at Holst Centre, “TactoTek’s IMSE platforms inherently provide substantial sustainability benefits by significantly reducing the number of components and amount of materials required for electronic solutions. Solving the challenge of separating diverse materials in an IMSE part we can approach circularity for IMSE and certain other types of rigid and flexible printed electronics solutions.”

Creating smart surfaces

TactoTek is the pioneer and leading innovator of IMSE technology. The company’s technology platforms integrate printed electronics and electronic components within 3D injection-molded plastics to create smart surfaces for uses such as lighting and human-machine interfaces (HMIs). Because IMSE is licensed by some of the world’s largest manufacturers, sustainability gains can scale quickly.

“Electronics content is increasing across many markets, including automotive, appliances, IoT, and others, therefore, driving to full circularity for electronics is an important aspect of achieving global greenhouse gas emissions reduction and sustainability,” according to TactoTek’s CTO Antti Keränen. “TNO at Holst Centre has earned its reputation as a premiere research institution and TactoTek is enthusiastic about our partnership to create the next generation of fully recyclable electronics. Together we can assess techniques that span design, production, and post-use reclamation.”

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