TechBlick has unveiled the programme for the upcoming “Future of Electronics RESHAPED” conference and exhibition, taking place on 22-24 October 2024, at the Estrel Congress Center in Berlin.
This event promises to be a cornerstone for industry professionals, featuring a world-class and fresh agenda, an exciting exhibition floor, and insightful expert-led masterclasses and tours.
“Join us and 650 others to RESHAPE the Future of Electronics, making it additive, sustainable, printed, flexible, R2R, hybrid, 3D, structural, soft, InMould, textile, stretchable and wearable,” said Dr Khasha Ghaffarzadeh, CEO of TechBlick.
Agenda highlights
The three-day event will offer a comprehensive and global curated agenda with three parallel tracks. Confirmed speakers include Forvia, European Space Agency, Meta, Decathlon, Airbus, Air Force Research Laboratories, Fuji, Datwyler, Motherson Innovations, Würth Elektronik, Avery Dennison, LPKF, Marquardt, Louisenthal Papierfabrik, imec, Nextflex, and many others.
Exhibition focus
The exhibition floor will feature 80+ exhibitors, representing the entire array of cutting-edge technologies and products as well as the entire global value chains. According to the organisers, it is the chance to see, touch and feel the latest in the field.
Masterclasses
The show includes 12 industry- and expert-led masterclasses covering many important applications, manufacturing methods, and materials. “These are must-attend classes for anyone wishing to develop in-depth knowledge and practical understanding,” underlined Ghaffarzadeh.
Tours
Attendees will have a choice of four tours to world-famous institutions like Fraunhofer IZM and Fraunhofer IAP as well as exhibiting printed electronics equipment makers and manufacturers like Inuru and Quantica.
“You can network with over 650 professionals from around the world, connecting with customers, partners and peers,” summarised TechBlick’s CEO.