TechBlick’s international conference and exhibition, The Future of Electronics RESHAPED USA, will take place on 10–11 June 2026 at the Computer History Museum in Mountain View, California. The event will bring together stakeholders from across the additive, printed, hybrid and 3D electronics value chain.
More than 600 participants and 80 exhibitors expected
Positioned in the heart of Silicon Valley for the first time, the 2026 edition is expected to attract more than 600 participants and 80 exhibitors from around the world. The programme will feature three parallel conference tracks, complemented by masterclasses and technical tours, with a focus on translating emerging technologies into practical applications.
RESHAPED USA addresses a wide range of topics related to next-generation electronics, including additive and printed manufacturing, flexible and stretchable electronics, wearable and textile integration, sustainable materials, hybrid systems, and structural and 3D electronics. The event is designed to connect end-users and product developers with material suppliers, equipment manufacturers, and applied research organisations.
Partnership with NextFlex
A key element of the 2026 programme is a new partnership with NextFlex, the US-based consortium supporting the printed and hybrid electronics ecosystem. As part of this collaboration, the event will host a NextFlex Innovation Day, aimed at fostering collaboration between industry, academia, and government-supported initiatives in North America.
“Electronics RESHAPED USA has firmly established itself as the premier event for our industry in North America, consistently selling out year after year. This is now the home of Printed, Additive, and Hybrid Electronics. By bringing the show to the heart of Silicon Valley for the first time, we expect record-breaking growth. If you are active in, using, or exploring these technologies, this is the definitive place to be,” says Dr Khasha Ghaffarzadeh, CEO of TechBlick.
https://www.techblick.com/electronicsreshapedusa