Nordmeccanica and Nordson present the CWM, a fully integrated closed-loop control system set to change flexible packaging manufacturing. According to the two partners, monitoring and managing coating weight during the converting process will never be the same. Over the years, advancements in technology and chemistry, along with the implementation of stricter regulations, have made flexible […]
Read more »From 23 to 25 September 2025, the packaging sector will gather in Nuremberg again for FACHPACK, the European trade fair for packaging, technology and processing. At NürnbergMesse, preparations are in full swing. The around 1,400 exhibitors expected will be spread over 11 exhibition halls. Ninety percent of the display area has already been booked. As […]
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All images (c) Martin Hirschmann
From 23-24 October, the global TechBlick community gathered at The Estrel Berlin for TechBlick’s flagship event, “The Future of Electronics RESHAPED”. In our image gallery, we have compiled some event photos for you.
From 12-13 June, the global TechBlick community gathered at UMass Boston for the first American edition of “The Future of Electronics RESHAPED”. In our image gallery, we have compiled some event photos for you. All images (c) Martin Hirschmann