Nordmeccanica and Nordson present the CWM, a fully integrated closed-loop control system set to change flexible packaging manufacturing. According to the two partners, monitoring and managing coating weight during the converting process will never be the same. Over the years, advancements in technology and chemistry, along with the implementation of stricter regulations, have made flexible […]
Read more »From 23 to 25 September 2025, the packaging sector will gather in Nuremberg again for FACHPACK, the European trade fair for packaging, technology and processing. At NürnbergMesse, preparations are in full swing. The around 1,400 exhibitors expected will be spread over 11 exhibition halls. Ninety percent of the display area has already been booked. As […]
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As in previous years, the OE-A hosted a pavilion at CES 2025. We asked Managing Director Dr Klaus Hecker about his impressions directly from Las Vegas. You just came back from CES in Las Vegas, where OE-A had a joint pavilion with some of its members. Which overall trends did you see? Dr Klaus Hecker: […]
PRO Flextronics sat down with Stefan Winter, Managing Director of RK Siebdrucktechnik, for an exclusive interview on the occasion of the 40th anniversary of the company based in Rösrath, Germany. Mr Winter, let’s start with the history of RKS, founded in 1984. How did it all begin – and what were some of the milestones […]
TechBlick’s flagship event in Berlin has recorded a successful first day with a high visitor turnout and satisfied exhibitors. “This is where the latest updates are unveiled, where all the key conversations take place and where new ideas and projects are forged,” stated Dr Khasha Ghaffarzadeh, CEO of TechBlick. In this article, we provide you […]
Today, Dr Khasha Ghaffarzadeh, CEO of TechBlick, delivered his opening remarks to a well-filled auditorium at UMass Boston, welcoming the global TechBlick community to the first American instalment of the event series “The Future of Electronics RESHAPED”, which is the counter piece to the Berlin event (23-24 October 2024). PRO Flextronics’ Editor-in-Chief Martin Hirschmann reports […]
From 12-13 June 2024, TechBlick, a leading platform for emerging technologies, is holding a US edition of its successful ‘The Future of Electronics RESHAPED’ conference and exhibition in Boston. PRO Flextronics has gathered some last-minute information for the American debut of the event series. According to organiser TechBlick, the conference and exhibition will offer a […]