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Title graphic Inno-Fiber
29. April 2026

Inno-Fiber 2026 – Paperisation between ambition and reality

With the launch of the “Inno-Fiber” event series, Innoform Coaching GmbH has created a platform dedicated to supporting the transformation of the packaging industry. Under the theme “Functional papers for packaging applications,” experts from industry and research gathered in Osnabrück on 15–16 April 2026 to discuss the potential, trade-offs and technological progress of fibre-based packaging […]

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Feature

Schobertechnologies – Higher output with rotary punching

Schobertechnologies introduced rotary punching technology to the paper, film and foil converting industry decades ago. The process offers a range of advantages, including higher output, efficiency, quality and precision, as well as high process reliability and production stability. It is also regarded as a comparatively environmentally friendly manufacturing method. How rotary punching works Rotary punching […]

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Rotary punching technology from Schober
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11. February 2026 |

Heraeus Electronics – Driving PriElex forward as the go-to solution for printed electronics

PRO Flextronics sat down for an interview with Ryan Banfield, Global Product Manager, PriElex, at Heraeus Electronics. The company will showcase its polymer thick film portfolio at the upcoming LOPEC 2026 tradeshow. Mr Banfield, the flexible and printed electronics industry is entering 2026 with cautious optimism, as reflected in the latest OE-A Business Climate Survey. […]

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10. February 2026 |

nsm – Transfer of perovskite processes from lab to pilot production

PRO Flextronics sat down for an interview with Michael Schläfli, CEO of nsm, which is based in Zofingen, Switzerland. His company offers an extensive portfolio of printing, coating and laminating equipment, with a special emphasis on pushing the boundaries of innovation in printed electronics. Mr Schläfli, your company nsm has been exhibiting at LOPEC for […]

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5. February 2026 |

Henkel Printed Electronics – Material innovation at the core

At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]

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16. October 2025 |

Heraeus Electronics – Medical sensors with polymer thick films

Artificial intelligence is accelerating breakthroughs in healthcare, enabling earlier disease detection, personalised treatment, and remote monitoring. With AI’s ability to process vast datasets, medical professionals can now deliver faster, more accurate care – even from the comfort of a patient’s home. At the heart of this transformation are medical sensors, such as continuous glucose monitors […]

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2. June 2025 |

Heraeus Electronics advances the integration of printed electronics

In a conversation with PRO Flextronics, Mark Challingsworth, Global Head of Business Line Thick Film Materials, and Ryan Banfield, Product Manager PriElex at Heraeus Electronics, showcase the PriElex portfolio of printed electronics materials and its benefits for our industry. Mr Challingsworth, Mr Banfield, what are PriElex Functional Printed Electronics Materials, and how do they fit […]

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