VTT-originating startups attract €445M equity funding in 2025
In 2025, six VTT-originating startups secured a combined €445 million in equity funding. Notably, each of these funding rounds exceeded €10 million. The Finnish startup sector has grown to over 12.5 billion euros in turnover and offers high-value-added jobs to over 50.000 people. The year 2025 was record-breaking for Finnish deep tech companies that are […]
Imec launches university consortium around next-gen chips
Imec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first-of-its-kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and chip architecture research for the next generation of chips. The consortium will benefit […]
Fraunhofer IPMS collaborates with Korean TSN Lab
The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the “Global Cooperative R&D” funding programme. The aim is to develop a next generation of 10Base-T1S IP cores for automotive and industrial communication applications in order to address the growing demand for scalable and […]
Fraunhofer IPMS – Bright and efficient red OLED microdisplays
Scientists at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a groundbreaking red OLED microdisplay that is both exceptionally bright and highly efficient. The first results of this innovative technology will be presented at the SID Mid-Europe Conference 2026 under the theme “Augmented Vision: Displays for Defense,” taking place from 16-17 March, in Lisbon, […]
Fraunhofer IPMS closes characterisation gap in organic materials
The Fraunhofer Institute for Photonic Microsystems IPMS has developed innovative chips that are revolutionising the characterisation of organic materials and accelerating the development of new electronic applications. A newly developed measuring adapter allows for the first time simultaneous contact with up to eight interdigital electrode pairs, setting new standards in precise material analysis. In the […]