On 8 and 9 October 2026, INNO-Pouch will bring the European pouch industry together for the ninth time – hosted by HP in Sant Cugat (Barcelona), Spain. As the only European trade event with an exclusive focus on stand-up pouches, this year’s event will be dedicated to the three pillars of modern flexible packaging: digitalisation, compliance and technical performance – whilst also offering an exclusive insight into the HP Digital Pouch Factory.
Under the theme ‘Smart Pouches – Digital, Compliant, Tight’, international experts will discuss how digital technologies, new material concepts and regulatory requirements are shaping and accelerating the development of the next generation of stand-up pouches. The focus will be on AI-supported packaging development and digital product information. Experts will outline practical approaches that comply with the strict requirements of EU regulations (including the PPWR) in a legally compliant manner. Technologically, the emphasis is on the challenge of ‘tightness’ – how mono-materials can maintain maximum barrier performance and seal strength despite reduced complexity.
Europe’s pouch experts gather in Barcelona
The English-language congress will be simultaneously interpreted into several languages, thereby creating the ideal conditions for the international exchange of knowledge, experience and best practices. Highlights of the programme include:
- Christoph Waldau (Berndt+Partner) on strategies for the optimal use of stand-up pouches and the question of when pouches represent the best packaging solution
- Claire Gusko (one.five) on current challenges and potential solutions for recyclable Doypacks
- Alexandre Zuber (Interzero) on digital tools for implementing recyclability, PPWR requirements and packaging compliance
- Philippe Van Damme (LyondellBasell) with practical examples of mono-material solutions based on PE and PP
- Yael Barak (HP Printing and Computing Solutions) The 5 Great Transitions in the Flexible Packaging Industry
- Milena Seybold (Herrmann Ultraschalltechnik) on ultrasonic sealing technologies for mono-material and spout pouches.
Exclusive insights into the HP Digital Pouch Factory
A particular highlight is the tour of the HP Digital Pouch Factory at the Sant Cugat del Vallès site. Participants will gain insights into modern digital printing and production processes for flexible packaging and experience innovative pouch technologies in an industrial setting.
Networking for the packaging of tomorrow
In addition to the specialist presentations, INNO-Pouch offers a wide range of opportunities for personal exchange. Manufacturers, brand owners, converters, machinery manufacturers and technology providers use the event to share experiences, forge new contacts and develop joint solutions to the challenges facing the packaging industry.
“The future of flexible packaging emerges where material innovations, digitalisation and sustainability converge. With INNO-Pouch, we are creating an international platform where experts from across Europe can share their knowledge and work together on the packaging solutions of tomorrow,” says Julian Thielen, Co-Managing Director of Innoform Coaching GmbH
INNO-Pouch