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27. May 2024 |

Research

Rapidus and Fraunhofer IZM join forces for high-end performance packaging

Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, and Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, join forces for advanced packaging solutions for 2nm node high-performance computing modules. Rapidus is building a fab on the island of Hokkaido to manufacture 2nm node microchips and the related high-end performance package. METI, Japan‘s […]

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23. May 2024 |

Research

Crucial role for imec in EU Chips Act

At its technology forum ITF World 2024, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, announced it will host the NanoIC pilot line. This pilot line taps into the EU Chips Act vision to accelerate innovation, drive economic growth, and strengthen Europe’s semiconductor ecosystem. With its R&D pilot line, imec aims […]

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23. May 2024 |

Companies & Markets

Wiliot introduces new ambient IoT food safety initiative

Underscoring its commitment to set a new benchmark for food safety, Wiliot, an ambient Internet of Things (IoT) pioneer, announced a major new food safety initiative that works to create completely transparent and traceable supply chains – soon required for FSMA 204 compliance – through the adoption of ambient IoT technology. Ambient IoT is a […]

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22. May 2024 |

Companies & Markets

Online Exclusive

Fortune Business Insights – “Smart Packaging enables revolution in product protection”

Packaging enhances the aesthetic appeal of products. Gone are the days of traditional packaging techniques, which included simple cardboard boxes and containers. The new-age technology assists in turning cardboard into interactive pieces. The recent buzz in this dynamic space is about smart packaging, which is an alluring blend of traditional packaging with integrated technology. Smart […]

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21. May 2024 |

Companies & Markets

TactoTek licenses IMSE technology to Polestar and expands operations in Japan

Polestar, a Swedish electric car brand, and Finnish smart surface pioneer TactoTek have entered a collaboration to explore integration of Injection Moulded Structural Electronics (IMSE) technology into Polestar’s vehicle programmes. The collaboration includes Polestar licensing TactoTek’s IMSE technology, products, and solutions to explore innovative lighting and human-machine interface (HMI) use cases. IMSE parts are manufactured […]

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