Royal Mail and Wiliot – Award-winning deployment of ambient IoT
Every industry has its awards season, but for supply chain and logistics, the spotlight hits a little differently. Innovation here goes beyond prestige – it’s defined by technology that’s proven in the real world, at industrial scale, and under harsh operational pressures. That’s why this year’s recognition of Royal Mail and Wiliot stands out. It […]
LG Display wins two CES 2026 Innovation Awards for automotive
LG Display, a leading innovator of display technologies, announced that two of its world-first automotive display innovations – Dual View OLED and Under Display Camera-infrared (UDC-IR) OLED – have been recognised with CES 2026 Innovation Awards from the Consumer Technology Association (CTA), the organiser of CES, the world’s largest IT and consumer electronics exhibition. Reaffirming […]
Imec to build regional research & development hub in Qatar
At this week’s Mobile World Congress Doha, imec – a global leader in nanoelectronics and digital innovation – unveiled its plans to launch a regional research & development hub in Qatar in early 2026. Supported by Invest Qatar, the country’s investment promotion agency, and the Qatar Research, Development & Innovation Council (QRDI), the centre will […]
Tageos launches new NFC and dual-frequency RFID inlays
Tageos, a global leader in RFID and wireless IoT inlays and tags, announced two new additions to its growing portfolio. Developed in close collaboration with EM Microelectronic, a pioneer in RFID for more than 30 years, the new products offer Near Field Communication (NFC) and Dual-Frequency (HF/NFC and UHF) functionality for tagging a broad variety […]
productronica 2025 drives positive industry trend
From 18-21 November, over 1,600 exhibitors from 52 countries met at productronica to present innovations in electronics development and production. Compared to the previous edition, this year’s event saw an increase of around 20 percent in exhibitor numbers and more than 10 percent in the number of visitors. The key topics included advanced packaging, power […]