Fraunhofer IZM – Ultra-thin chip foil packages for flexible electronics
Flexible electronics enable more comfortable sensor patches, smarter packaging, and adaptable human-machine interfaces. In the CFP project, chip foil packages less than 150 micrometers thick are being developed to reliably protect electronic functions and enable resource-efficient production in high volumes. This paves the way for the widespread industrial use of flexible electronics. Novel ultra-thin and […]
Brilliant Matters and HeiQ – OPV for seamless energy harvesting
Brilliant Matters Inc., a Canadian developer of advanced organic photovoltaic (OPV) solutions, HeiQ, a global leader in deeptech material innovation, and Solar Factory, a research group of the Institute of Energy, Materials and Devices – Photovoltaics (IMD-3) at Forschungszentrum Jülich, announced the successful integration of HeiQ Xpectra silver nanowire technology into Brilliant Matters’ next-generation OPV […]
LC Elektronik – Silver is expensive. So why do we still print with it?
Imagine a customer looking at the bill of materials for a printed electronic circuit. Everything seems reasonable until they see the price of conductive silver ink. Then comes a question that anyone working in printed electronics has probably heard many times: “Do we really need to use silver?” It is a fair question. Silver is […]
TechBlick Berlin – Materials set the stage for next-gen electronics
From silver-coated copper and room-temperature copper processing to biosensor inks, graphene, stretchable conductors and advanced substrates: TechBlick Berlin (21 and 22 October, The Estrel Berlin) will put materials innovation at the heart of its 2026 programme. When discussing the future of printed and flexible electronics, it is tempting to focus on the finished product: a […]
LOPEC Startup Award opens application phase
Start-ups developing innovative solutions in printed and flexible electronics can now apply for the LOPEC Startup Award 2027. Applications are open until 7 November 2026. The search for the next generation of innovative companies in printed and flexible electronics is underway: the application phase for the LOPEC Startup Award is now open. The award is […]