All News
20. October 2026 |

Products & Innovations

DP Patterning, Avery Dennison & IUMAT unveil flexible heater demo

DP Patterning, Avery Dennison and IUMAT (Institute for Materials Research from Hasselt University and imec) have built a flexible heater demonstrator for car interiors. It shows how heated surfaces can be made in series volumes, in Europe, at low cost, replacing printed silver and chemical etching as the production process. The demonstrator will be shown […]

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16. October 2026 |

Research

Fraunhofer IZM – Ultra-thin chip foil packages for flexible electronics

Flexible electronics enable more comfortable sensor patches, smarter packaging, and adaptable human-machine interfaces. In the CFP project, chip foil packages less than 150 micrometers thick are being developed to reliably protect electronic functions and enable resource-efficient production in high volumes. This paves the way for the widespread industrial use of flexible electronics. Novel ultra-thin and […]

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14. October 2026 |

Companies & Markets

Brilliant Matters and HeiQ – OPV for seamless energy harvesting

Brilliant Matters Inc., a Canadian developer of advanced organic photovoltaic (OPV) solutions, HeiQ, a global leader in deeptech material innovation, and Solar Factory, a research group of the Institute of Energy, Materials and Devices – Photovoltaics (IMD-3) at Forschungszentrum Jülich, announced the successful integration of HeiQ Xpectra silver nanowire technology into Brilliant Matters’ next-generation OPV […]

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13. October 2026 |

Companies & Markets

LC Elektronik – Silver is expensive. So why do we still print with it?

Imagine a customer looking at the bill of materials for a printed electronic circuit. Everything seems reasonable until they see the price of conductive silver ink. Then comes a question that anyone working in printed electronics has probably heard many times: “Do we really need to use silver?” It is a fair question. Silver is […]

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8. October 2026 |

Exhibitions & Events

TechBlick Berlin – Materials set the stage for next-gen electronics

From silver-coated copper and room-temperature copper processing to biosensor inks, graphene, stretchable conductors and advanced substrates: TechBlick Berlin (21 and 22 October, The Estrel  Berlin)  will put materials innovation at the heart of its 2026 programme. When discussing the future of printed and flexible electronics, it is tempting to focus on the finished product: a […]

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