TactoTek achieves 300th granted patent
TactoTek, a pioneer in In-Mould Structural Electronics (IMSE), has reached a major milestone with the granting of its 300th patent. This achievement reflects the company’s long-standing commitment to advancing both technology and practical, cost-effective manufacturing solutions for the in-mould electronics market. TactoTek’s IP approach is rooted in technological advancement and real-world applicability, resulting in a […]
Pragmatic appoints John Quigley EVP of Engineering
Pragmatic Semiconductor Ltd. announced the appointment of John Quigley as Executive Vice President (EVP) of Engineering with responsibility for Technology Development, IC Design and Applications Engineering at the company. With an extensive career of over 35 years in the semiconductor and technology sector spanning engineering, operational and leadership roles, Quigley brings industry-leading technical domain expertise […]
Canatu builds an entirely new network of expertise in Finland
Finnish deep tech company Canatu is developing solutions for critical technology sectors based on carbon nanotubes. The company heads Carbon Age, a leading company programme funded by Business Finland. Carbon Age aims to create an entirely new ecosystem in Finland. “We are making it possible for Europe to keep pace with developments in the semiconductor […]
Avery Dennison unveils recycling-compatible RFID label
Avery Dennison announced a breakthrough in recyclable labelling: The first radio-frequency identification (RFID) label to receive APR Design for Recyclability (DfR) recognition from the Association of Plastic Recyclers (APR). This marks an industry first for an RFID label, validating its compatibility with North America’s PET recycling stream. Avery Dennison has combined its proprietary CleanFlake adhesive […]
15 years of Fraunhofer IZM-ASSID – The future of microelectronics
With a festive event and a symposium on 24 June 2025, Fraunhofer IZM-ASSID (All Silicon System Integration Dresden) celebrated 15 years of success in its field. Since its foundation in 2010, the Fraunhofer IZM’s Saxon site has become a globally respected engine of innovation in 3D system integration and wafer-level packaging – and a crucial […]