LOPEC 2024 ends on a high note: Printed electronics drives sustainability
LOPEC 2024 once again closed with a record number of exhibitors: 176 companies from 28 countries and more than 2400 visitors from 48 countries came to the ICM at Messe München from 5-7 March. The leading trade fair and most important conference in the industry provided information about innovations and trends for the whole range […]
OE-A Business Climate Survey: Printed electronics industry remains positive but cautious in 2024
The results of the latest OE-A Business Climate Survey show slightly lower expectations for 2024 compared to the projections made in the 2023 surveys. However, the decline is at a high level: For 2024, responding association members expect a 13 percent increase in revenue for the flexible and printed electronics industry. “Our industry is even […]
Coatema and Heliosonic announce partnership
At LOPEC 2024, Coatema Coating Machinery GmbH presented itself together with partner HELIOSONIC. The launch of fuelcell2print, their high precision digital membrane coating system integrated into a world-class web handling infrastructure marked one of the highlights of the first show day in Munich. Key highlights include a seamless integration of the HELIOSONIC print head with […]
Heraeus Printed Electronics and SUSS MicroTec join forces
Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competencies of both companies to enable digital printing solutions for mass production in the electronics industry for the first […]
TactoTek and TNO at Holst Centre partner to advance IMSE and circularity
TactoTek and TNO at Holst Centre have entered a strategic relationship to advance the state-of-the-art of in-mould structural electronics (IMSE), including working together to build an ecosystem for sustainability and recycling. The companies’ joint research will include methods for recycling IMSE solutions that integrate circuitry and electronic components within 3D plastics. The companies share the […]