All News
10. July 2025 |

Products & Innovations

E Ink utilises Intel Smart Base to launch touch-enabled ePaper

E Ink, the originator, pioneer, and global commercial leader in ePaper technology, announced the launch of a groundbreaking ePaper touchpad solution for laptops, developed through the integration of Intel’s Smart Base, Innovation Platform Framework, and AI Assistant Builder technologies. This innovative solution combines colour ePaper with traditional laptop touchpads, creating a visual, AI-assisted human-machine interface […]

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9. July 2025 |

Companies & Markets

TactoTek achieves 300th granted patent

TactoTek, a pioneer in In-Mould Structural Electronics (IMSE), has reached a major milestone with the granting of its 300th patent. This achievement reflects the company’s long-standing commitment to advancing both technology and practical, cost-effective manufacturing solutions for the in-mould electronics market. TactoTek’s IP approach is rooted in technological advancement and real-world applicability, resulting in a […]

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8. July 2025 |

Companies & Markets

People & Appointments

Pragmatic appoints John Quigley EVP of Engineering

Pragmatic Semiconductor Ltd. announced the appointment of John Quigley as Executive Vice President (EVP) of Engineering with responsibility for Technology Development, IC Design and Applications Engineering at the company. With an extensive career of over 35 years in the semiconductor and technology sector spanning engineering, operational and leadership roles, Quigley brings industry-leading technical domain expertise […]

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4. July 2025 |

Companies & Markets

Canatu builds an entirely new network of expertise in Finland

Finnish deep tech company Canatu is developing solutions for critical technology sectors based on carbon nanotubes. The company heads Carbon Age, a leading company programme funded by Business Finland. Carbon Age aims to create an entirely new ecosystem in Finland. “We are making it possible for Europe to keep pace with developments in the semiconductor […]

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3. July 2025 |

Products & Innovations

Avery Dennison unveils recycling-compatible RFID label

Avery Dennison announced a breakthrough in recyclable labelling: The first radio-frequency identification (RFID) label to receive APR Design for Recyclability (DfR) recognition from the Association of Plastic Recyclers (APR). This marks an industry first for an RFID label, validating its compatibility with North America’s PET recycling stream. Avery Dennison has combined its proprietary CleanFlake adhesive […]

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