All News
31. October 2024 |

Companies & Markets

Industrias Alegre and TactoTek partner in in-mould electronics parts

Industrias Alegre from Valencia, Spain, has signed a collaboration agreement with TactoTek, a Finnish pioneer in smart surfaces and world leader in In-Mould Structural Electronics (IMSE) technology. The collaboration will involve the development of innovative human-machine interface (HMI) solutions that can be integrated into applications for different markets, especially automotive. New designs for lighter and […]

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30. October 2024 |

Research

New CSIRO facility takes flexible solar tech from lab to real world

Australia’s national science agency, CSIRO, has opened a $6.8 million facility in Clayton, Victoria, dedicated to taking its printed flexible solar technology out of the lab and into the real world, to help meet the growing demand for renewable energy across sectors. Unlike traditional silicon solar panels, CSIRO’s flexible solar cells are printed on thin […]

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29. October 2024 |

Companies & Markets

Exhibitions & Events

Rocket Award winner FLEXOO goes electronica 2024

FLEXOO will be exhibiting at electronica 2024, the world’s leading trade fair for electronics, held from 12-15 November at Messe München. This event gathers over 3,000 exhibitors and 70,000 visitors to explore groundbreaking technologies that shape a sustainable and connected world, covering fields from AI-powered automation to electromobility. At electronica, FLEXOO will showcase its cutting-edge […]

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26. October 2024 |

People & Appointments

SRI appoints Peter Marcotullio as SVP of Commercialisation

Peter Marcotullio has been named SRI’s new Senior Vice President of Commercialisation. In this role, Marcotullio will lead SRI’s efforts to deliver innovative solutions that address critical global challenges through a variety of commercial pathways. “Peter’s deep understanding of our research and his ability to identify commercial opportunities make him the ideal leader for this […]

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26. October 2024 |

Companies & Markets

Research

Fraunhofer IPMS and BASF – Improved microchip interconnections

More power, more energy-efficiency, more complexity – manufacturers of modern microchips are constantly facing new challenges, also regarding the electrical connections required. Fraunhofer IPMS and BASF have been working together on this problem for ten years. The teams have pooled their infrastructure and expertise and thus have made it possible to evaluate chemicals, processes and […]

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