The global converting industry is preparing for the next edition of ICE Europe, as the event further strengthens its position as the world’s leading exhibition for the conversion of flexible, web-based and sheet materials. Taking place in Munich from 9–11 March 2027, ICE Europe, organised by RX, will once again bring together the full converting […]
Read more »Two projects from KOCH Robot Systems show that packaging and palletising rolls no longer has to be a feat of strength. Nonwovens, adhesive tapes and technical films are true all-rounders: they protect, insulate and connect, making them indispensable in medicine, hygiene and industry. Their value only becomes apparent at the end of the production chain: […]
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Fraunhofer Institute for Photonic Microsystems IPMS, together with the Helmholtz Centre for Environmental Research (UFZ) and the Center for Applied Research and Technology e.V. (ZAFT), is launching the FastSense research project – Innovative sensor technology and AI for environmental and hazardous substance monitoring. The project aims to develop a portable, fast measurement system combining state-of-the-art […]
The Fraunhofer Institute for Photonic Microsystems IPMS has launched the publicly funded SMut project, in collaboration with its partners Credoxys and SweepMe! to develop an innovative measurement system for precise thin-film characterisation. This system will enable experiments to be conducted under variable conditions, setting new standards in the characterisation of organic materials. Thin films in […]
In 2025, six VTT-originating startups secured a combined €445 million in equity funding. Notably, each of these funding rounds exceeded €10 million. The Finnish startup sector has grown to over 12.5 billion euros in turnover and offers high-value-added jobs to over 50.000 people. The year 2025 was record-breaking for Finnish deep tech companies that are […]
Imec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first-of-its-kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and chip architecture research for the next generation of chips. The consortium will benefit […]
The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the “Global Cooperative R&D” funding programme. The aim is to develop a next generation of 10Base-T1S IP cores for automotive and industrial communication applications in order to address the growing demand for scalable and […]
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