Research
Packaging for baked goods
13. November 2026

SÜDPACK – Baked goods packaging in the food retail sector

The EU Packaging Regulation (PPWR) also imposes new requirements on manufacturers of industrially produced baked goods for the food retail sector. The focus is on recyclability: established polyamide (PA) composite structures must be reviewed and, where necessary, replaced with more recyclable designs. The film manufacturer SÜDPACK has consistently developed its portfolio and already offers solutions […]

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4. November 2026 |

Virginia Tech research unlocks secrets of liquid metal & electricity

Soft electronics can stretch, bend, and flex, making them ideal for wearables, robots, and damage resilient electronics. A new study at Virginia Tech reveals how microscopic cracks can turn an insulating material into an electrical conductor. Liquid metal makes flexible electronics work When electronics need to stretch, bend, or flex, like a wearable sensor or […]

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3. November 2026 |

Noak raises €5M to industrialise perovskite-silicon tandem solar technology

Noak, a new spin-off of imec and UHasselt, has raised €5 million to scale and industrialise the development of the next generation of solar: perovskite–silicon tandem PV. The seed investment, provided by the Helios Foundation, Nuhma and V2HFin, marks an important next step in bringing this promising technology closer to European manufacturing. Fastest-growing renewable energy […]

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2. November 2026 |

NUS researchers thread world’s first touchscreen into a garment

Researchers at the National University of Singapore’s College of Design and Engineering (CDE) have developed a fibre that functions as pixels and senses touch at the same time, integrating 54 of them into a sleeve to create the world’s first touchscreen built into a garment. The sleeve displays images and video, responds to finger presses […]

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27. October 2026 |

KAIST predicts the lifetime of blue OLEDs

KAIST, Kyung Hee University, Hanbat National University, and ASTA Inc. identify a relationship between the magnetic field response and the operational lifetime of blue OLEDs. Could a magnetic field be used to identify in advance which OLEDs will keep smartphone and TV screens bright the longest? A KAIST research team has developed a technique that […]

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16. October 2026 |

Fraunhofer IZM – Ultra-thin chip foil packages for flexible electronics

Flexible electronics enable more comfortable sensor patches, smarter packaging, and adaptable human-machine interfaces. In the CFP project, chip foil packages less than 150 micrometers thick are being developed to reliably protect electronic functions and enable resource-efficient production in high volumes. This paves the way for the widespread industrial use of flexible electronics. Novel ultra-thin and […]

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