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28. May 2025

Afera & IVK launch PCF Calculation Tool for adhesives & tapes

Afera, The European Adhesive Tape Association, and the German Adhesives Association, Industrieverband Klebstoffe e.V. (IVK), announce the launch of TACK (Tapes and Adhesive Calculation Kit), a collaborative Product Carbon Footprint (PCF) Calculation Tool for the adhesives and tapes industry. “TACK is tailored to the specific needs of the adhesive and adhesive tape value chain, developed […]

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Feature

FACHPACK 2025 – “Technology needs diversity!”

NürnbergMesse, the organisers of FACHPACK, and M2N Media, are intensifying their collaboration. At FACHPACK 2025, we will be hosting an exclusive Pavilion “Converting meets Packaging” for key players from our industry. In the run-up to the trade fair that will take place from 23-25 September in Nuremberg, we will be reporting regularly about the event, […]

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Phuong Anh Do
All News
21. May 2025 |

LG Display selected as Distinguished Paper at SID Display Week

LG Display, a leading innovator of display technologies, announced that its fourth-generation OLED panel research was selected as a Distinguished Paper of the Year by the Society for Information Display (SID), the world’s most prestigious display organisation, at SID Display Week 2025. Each year, SID awards its Distinguished Paper designation to the top 5% of […]

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21. May 2025 |

NY CREATES and Fraunhofer IPMS announce collaboration

NY CREATES and Fraunhofer IPMS announced at a signing ceremony a new Joint Development Agreement (JDA) to drive research and development focused on memory devices. The JDA will leverage and link the strengths of each organisation to engineer, develop, and characterise these devices that are critical for advancing the memory development ecosystems of each respective […]

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16. May 2025 |

Vuzix & Fraunhofer IPMS – Milestone in MicroLED backplanes

Vuzix Corporation, a leading supplier of Smart Glasses and Augmented Reality (AR) technology and products, and Fraunhofer Institute for Photonic Microsystems IPMS, a globally renowned research institution based in Germany, are excited to announce a major milestone in the development of a custom microLED backplane. Sample production for high-performance microLED backplanes The collaboration has led […]

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28. April 2025 |

Fraunhofer IPMS – High-voltage CMOS for bright microdisplays

A common method to increase the brightness of OLEDs while maintaining a long lifespan is the use of multiple stacked OLEDs. Scientists at the Fraunhofer Institute for Photonic Microsystems IPMS have now developed an innovative high-voltage CMOS backplane that enables exceptionally bright microdisplays. These will be presented for the first time at the SID Display […]

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10. April 2025 |

DITF – Elastic inks for textile-integrated electronics

Electrically conductive prints on textiles are the basis for functional textiles with electronic functions, so-called smart textiles. Conductive inks and binders must be well matched to ensure permanent conductivity even under external mechanical influences such as stretching, pressure and bending. The DITF are working on new ink formulations that meet these requirements. Sports, fashion and […]

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