Research
Nick Copeland from BOBST
26. March 2026

BOBST unites with industry partners at interpack 2026

BOBST aims to make an impact at interpack 2026 in Düsseldorf, Germany, from 7-13 May, through a coordinated programme of partner collaborations, joint presentations, demonstrations and events. Spanning labels, flexible packaging, folding cartons and corrugated board, BOBST intends to highlight the future of packaging production. Partnership ecosystem The company’s strategy at Interpack 2026 is built […]

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Feature

Schobertechnologies GmbH – Rotary converting technologies for fuel cell manufacturing

Fuel cell technology is widely regarded as a key building block of future energy and mobility systems. From automotive applications to stationary power generation, fuel cells promise high efficiency and low emissions – provided that scalable, reliable manufacturing processes can be established. One of the critical challenges lies in the precise and gentle processing of […]

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Fuell cell technologies are a growth market for Schobertechnologies
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25. March 2026 |

Fraunhofer IPMS expects a new level of thin-film characterisation

The Fraunhofer Institute for Photonic Microsystems IPMS has launched the publicly funded SMut project, in collaboration with its partners Credoxys and SweepMe! to develop an innovative measurement system for precise thin-film characterisation. This system will enable experiments to be conducted under variable conditions, setting new standards in the characterisation of organic materials. Thin films in […]

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19. March 2026 |

VTT-originating startups attract €445M equity funding in 2025

In 2025, six VTT-originating startups secured a combined €445 million in equity funding. Notably, each of these funding rounds exceeded €10 million. The Finnish startup sector has grown to over 12.5 billion euros in turnover and offers high-value-added jobs to over 50.000 people. The year 2025 was record-breaking for Finnish deep tech companies that are […]

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16. March 2026 |

Imec launches university consortium around next-gen chips

Imec, a world-leading research and innovation hub in advanced semiconductor technologies, has launched a first-of-its-kind consortium with 26 European university groups that will jointly work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and chip architecture research for the next generation of chips. The consortium will benefit […]

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25. February 2026 |

Fraunhofer IPMS collaborates with Korean TSN Lab

The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the “Global Cooperative R&D” funding programme. The aim is to develop a next generation of 10Base-T1S IP cores for automotive and industrial communication applications in order to address the growing demand for scalable and […]

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11. February 2026 |

Fraunhofer IPMS – Bright and efficient red OLED microdisplays

Scientists at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a groundbreaking red OLED microdisplay that is both exceptionally bright and highly efficient. The first results of this innovative technology will be presented at the SID Mid-Europe Conference 2026 under the theme “Augmented Vision: Displays for Defense,” taking place from 16-17 March, in Lisbon, […]

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