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27. January 2026 |

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Products & Innovations

Hamamatsu Photonics – Rising interest in laser technology for thermal surface activation

In recent years, laser surface treatment has gained popularity due to its efficiency and effectiveness. Today, laser applications in manufacturing are numerous. Building on these established techniques, new thermal laser processes are emerging that activate surfaces before the application of glues or adhesive films. This growing interest stems from laser process development, improved system integration […]

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26. January 2026 |

Companies & Markets

Valeo enters high-volume production with TactoTek’s IMSE

Valeo, a global leader in automotive lighting systems, announces a major programme award from a premium global automaker. As part of this programme, Valeo is introducing a new, state-of-the-art, automated high-volume manufacturing solution utilising TactoTek’s In-Mould Structural Electronics (IMSE) technology. The awarded programme focuses on an innovative interior solution that integrates lighting and electronics into […]

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23. January 2026 |

Exhibitions & Events

Flexible and printed electronics – The highlights at LOPEC 2026

From indoor solar cells and green electronics to sensor systems for agriculture: At LOPEC in Munich, the world’s leading trade fair with accompanying conference for flexible, organic and printed electronics, visitors will gain valuable insight into the latest technological developments from 24-26 February 2026. More than 160 international exhibitors will be presenting new materials, manufacturing […]

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22. January 2026 |

Exhibitions & Events

TechBlick USA 2026 to take place in the heart of Silicon Valley

TechBlick’s international conference and exhibition, The Future of Electronics RESHAPED USA, will take place on 10–11 June 2026 at the Computer History Museum in Mountain View, California. The event will bring together stakeholders from across the additive, printed, hybrid and 3D electronics value chain. More than 600 participants and 80 exhibitors expected Positioned in the […]

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21. January 2026 |

Research

Fraunhofer IPMS closes characterisation gap in organic materials

The Fraunhofer Institute for Photonic Microsystems IPMS has developed innovative chips that are revolutionising the characterisation of organic materials and accelerating the development of new electronic applications. A newly developed measuring adapter allows for the first time simultaneous contact with up to eight interdigital electrode pairs, setting new standards in precise material analysis. In the […]

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