Beontag expands RFID portfolio – microwave-resistant & waterproof
Beontag, one of the world’s largest manufacturers of self-adhesives and smart tags such as RFID, NFC, and Bluetooth technology, has announced the arrival of its latest UHF labels designed for the food industry. The Carrier eWave UHF tag is a washable, industrial-grade label that enhances labelling options with greater versatility and sustainability. Designed for returnable […]
DITF – Elastic inks for textile-integrated electronics
Electrically conductive prints on textiles are the basis for functional textiles with electronic functions, so-called smart textiles. Conductive inks and binders must be well matched to ensure permanent conductivity even under external mechanical influences such as stretching, pressure and bending. The DITF are working on new ink formulations that meet these requirements. Sports, fashion and […]
Tageos launches Innovation Center of Excellence in Munich
Tageos, a global leader in the design and manufacture of innovative, high-performance RFID inlays and tags, and part of the Fedrigoni Group, announced the grand opening of its new state-of-the-art research and development facility in Munich, Germany. The Tageos Innovation Center of Excellence (ICoE) is the company’s bold response to a strong customer and market […]
LUMINOSITY project – With the anodic arc into the future
The EU-funded LUMINOSITY project brings together research and industry partners across Europe to further develop perovskite solar cells on flexible substrates. The project partner Fraunhofer FEP is making promising progress in the deposition of tin oxide and cesium iodide using its expertise in anodic arc evaporation. These innovative technologies are the basis for the development […]
Chiplet-based technology – Baden-Württemberg attracts imec
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and the State Government of Baden-Württemberg, Germany, announced the launch of the Advanced Chip Design Accelerator (ACDA) at the Hannover Trade Fair. The new competence centre in Baden-Württemberg (Southwest of Germany) will develop state-of-the-art chiplet, packaging, system integration, sensing, and (edge) AI technology […]