Fraunhofer IZM – Ultra-thin chip foil packages for flexible electronics
Flexible electronics enable more comfortable sensor patches, smarter packaging, and adaptable human-machine interfaces. In the CFP project, chip foil packages less than 150 micrometers thick are being developed to reliably protect electronic functions and enable resource-efficient production in high volumes. This paves the way for the widespread industrial use of flexible electronics. Novel ultra-thin and […]
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