Canatu Plc has made two key appointments to its executive leadership team. Walter Braun will join as Chief Technology Officer (CTO) and Bernd Meier as Chief Marketing Officer (CMO), both taking effect on the 1st of September 2026. “These appointments form a strong foundation for the next phase of the company’s development,” says Maximilian Slawinski, […]
Read more »In flexible and printed electronics, the real challenge is not imagining new device concepts. It is validating them fast enough to matter. Whether the application is a flexible display, smart packaging, or thin-form energy storage, development teams need to assess how materials interact, how multilayer structures hold up, and how quickly a prototype can move […]
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Beontag, one of the world’s largest manufacturers of self-adhesives and smart tags such as RFID and NFC, has announced the launch of Steelwave Edge, the latest addition to the company’s on-metal RFID portfolio. Featuring support for Impinj Gen2X, Steelwave Edge was engineered to bridge the gap between performance and cost, offering a versatile mid-range solution […]
Avery Dennison, a global leader in materials science and digital identification solutions, announced that its AD CleanFlake RFID tags have officially secured RecyClass Technology Approval in Europe. Building on the portfolio’s existing Association of Plastic Recyclers (APR) Design Recognition in North America, Avery Dennison is now the first manufacturer to offer an RFID solution recognised […]
A light energy harvesting (LEH) product converts ambient indoor light into usable power, letting a device run for years with no batteries to replace and no cables to install. But the device is never defined by the solar cell alone. True energy autonomy comes only when the solar cell, power management, energy storage, microcontroller, communication, […]
Identiv, Inc., a global leader in RFID- and BLE-enabled Internet of Things (IoT) solutions, announced the expansion of its ID-Tiny product family, a portfolio of ultra-miniaturised HF/NFC inlays and tags designed to bring secure digital intelligence to compact products, small components, and high-value items where space is extremely limited. The expansion opens new possibilities for […]
The OE-A Competition 2027 is now open for submissions. The OE-A, an international working group for printed electronics within the VDMA, invites companies, start-ups, research institutes, and young professionals to submit their latest innovations in flexible and printed electronics. All selected projects will be showcased at LOPEC 2027 (2-4 March 2027) in Munich, where they […]
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