INO booth at LOPEC 2026
26. February 2026

Exhibitions & Events

LOPEC 2026 – Stable industry platform in challenging times

A total of 158 exhibitors from 29 countries, more than 2,400 visitors and a clear focus on marketable applications: From 24-26 February 2026 at Messe München’s International Congress Center, LOPEC once again confirmed its role as the world’s leading platform for flexible and printed electronics. Compared with the previous year, there was a slight increase […]

Read more »

Feature

Henkel Printed Electronics – Material innovation at the core

At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]

Read more »
A material paste for printed electronics
All News
27. February 2026 |

Exhibitions & Events

OE-A Spotlight

OE-A Competition – Winners announced at LOPEC

The winners of the OE-A Competition 2026 have been announced at the Award Show during LOPEC, highlighting the latest innovations in flexible, organic and printed electronics. Technological progress and market potential Each year, the competition recognises outstanding demonstrators and products that showcase the technological progress and market potential of the industry. The 2026 edition once […]

Read more »
25. February 2026 |

Research

Fraunhofer IPMS collaborates with Korean TSN Lab

The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the “Global Cooperative R&D” funding programme. The aim is to develop a next generation of 10Base-T1S IP cores for automotive and industrial communication applications in order to address the growing demand for scalable and […]

Read more »
25. February 2026 |

Companies & Markets

FLEXOO secures funding to scale Physical AI platform globally

FLEXOO, a pioneer in physical AI sensor technology, has successfully closed its Series A funding round, raising a total investment of €11M. Lead investors are eCAPITAL and AUMOVIO. The funds will drive FLEXOO’s global business with customers that are internationally leading in the battery storage and automotive industries. Additionally, it will enable FLEXOO to continuously […]

Read more »
23. February 2026 |

Companies & Markets

Bayflex Solutions and MSWtech announce partnership expansion

At LOPEC 2026, Bayflex Solutions, a leader in flexible electronics testing and lab automation, announces a significant strengthening of its partnership with MSWtech to expand testing capabilities at the FAPS Institute in Nuremberg later this year. This expansion introduces integrated hostile environment testing tailored for automotive and avionics applications, alongside specialised liquid immersion testing for […]

Read more »
20. February 2026 |

Products & Innovations

New compact LED heads from Hoenle

UV technology manufacturer Hoenle has developed new LED heads for its bluepoint LED eco LED UV curing device. The redesigned LED heads combine significantly higher performance with more compact dimensions and can be easily connected to existing bluepoint LED eco devices. The improved LED heads of the bluepoint LED eco are even more compact: with […]

Read more »
To top