Avery Dennison, a global leader in materials science and digital identification solutions, is set to further enhance its Near Field Communication (NFC) inlay portfolio with a flexible integrated circuit (FlexIC) product line, NFC Connect, from Pragmatic Semiconductor, a pioneer in flexible and sustainable semiconductor technology. First-to-market integration This first-to-market integration on a mass scale builds […]
Read more »At LOPEC 2026 in Munich, Henkel Printed Electronics will place materials firmly at the centre of printed electronics innovation. As a leading material and ink supplier, Henkel is using this year’s event to clearly refocus its message on what it delivers to customers: advanced material formulation, high-performance inks, and the expertise required to turn material […]
Read more »
The two European flagship projects Flex2Energy and COPE-Nano Center of Excellence were presented at LOPEC 2026 (24–26 February 2026, Munich), underlining Europe’s – and particularly Greece’s – growing role in green industry and sustainable energy production. LOPEC is regarded as one of the leading international platforms for organic and printed electronics, bringing together stakeholders from […]
The winners of the OE-A Competition 2026 have been announced at the Award Show during LOPEC, highlighting the latest innovations in flexible, organic and printed electronics. Technological progress and market potential Each year, the competition recognises outstanding demonstrators and products that showcase the technological progress and market potential of the industry. The 2026 edition once […]
A total of 158 exhibitors from 29 countries, more than 2,400 visitors and a clear focus on marketable applications: From 24-26 February 2026 at Messe München’s International Congress Center, LOPEC once again confirmed its role as the world’s leading platform for flexible and printed electronics. Compared with the previous year, there was a slight increase […]
The Fraunhofer Institute for Photonic Microsystems IPMS is working with the Korean TSN Lab on new real-time solutions as part of the “Global Cooperative R&D” funding programme. The aim is to develop a next generation of 10Base-T1S IP cores for automotive and industrial communication applications in order to address the growing demand for scalable and […]
You need to load content from reCAPTCHA to submit the form. Please note that doing so will share data with third-party providers.
More InformationYou are currently viewing a placeholder content from Turnstile. To access the actual content, click the button below. Please note that doing so will share data with third-party providers.
More InformationYou are currently viewing a placeholder content from Facebook. To access the actual content, click the button below. Please note that doing so will share data with third-party providers.
More InformationYou are currently viewing a placeholder content from Instagram. To access the actual content, click the button below. Please note that doing so will share data with third-party providers.
More InformationYou are currently viewing a placeholder content from X. To access the actual content, click the button below. Please note that doing so will share data with third-party providers.
More Information